M1A3P600-2FG484I
For Reference Only
| Part Number | M1A3P600-2FG484I |
| PNEDA Part # | M1A3P600-2FG484I |
| Description | IC FPGA 235 I/O 484FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 6,210 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 18 - Jun 23 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M1A3P600-2FG484I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M1A3P600-2FG484I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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M1A3P600-2FG484I Specifications
| Manufacturer | Microsemi Corporation |
| Series | ProASIC3 |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 110592 |
| Number of I/O | 235 |
| Number of Gates | 600000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 484-BGA |
| Supplier Device Package | 484-FPBGA (23x23) |
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Manufacturer Xilinx Inc. Series Spartan®-3 Number of LABs/CLBs 5120 Number of Logic Elements/Cells 46080 Total RAM Bits 737280 Number of I/O 565 Number of Gates 2000000 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 900-BBGA Supplier Device Package 900-FBGA (31x31) |
Manufacturer Intel Series ACEX-1K® Number of LABs/CLBs 360 Number of Logic Elements/Cells 2880 Total RAM Bits 40960 Number of I/O 249 Number of Gates 199000 Voltage - Supply 2.375V ~ 2.625V Mounting Type Surface Mount Operating Temperature 0°C ~ 70°C (TA) Package / Case 484-BBGA Supplier Device Package 484-FBGA (23x23) |
Manufacturer Xilinx Inc. Series Kintex® UltraScale+™ Number of LABs/CLBs 65340 Number of Logic Elements/Cells 1143450 Total RAM Bits 82329600 Number of I/O 512 Number of Gates - Voltage - Supply 0.698V ~ 0.876V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-FCBGA (42.5x42.5) |
Manufacturer Xilinx Inc. Series XC4000E/X Number of LABs/CLBs 100 Number of Logic Elements/Cells 238 Total RAM Bits 3200 Number of I/O 61 Number of Gates 3000 Voltage - Supply 4.5V ~ 5.5V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 84-LCC (J-Lead) Supplier Device Package 84-PLCC (29.31x29.31) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 276480 Number of I/O 252 Number of Gates 1500000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
