M1A3PE1500-1FG676I
For Reference Only
| Part Number | M1A3PE1500-1FG676I |
| PNEDA Part # | M1A3PE1500-1FG676I |
| Description | IC FPGA 444 I/O 676FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 4,590 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 7 - May 12 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M1A3PE1500-1FG676I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M1A3PE1500-1FG676I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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M1A3PE1500-1FG676I Specifications
| Manufacturer | Microsemi Corporation |
| Series | ProASIC3E |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 276480 |
| Number of I/O | 444 |
| Number of Gates | 1500000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
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Manufacturer Xilinx Inc. Series Artix-7 Number of LABs/CLBs 5900 Number of Logic Elements/Cells 75520 Total RAM Bits 3870720 Number of I/O 300 Number of Gates - Voltage - Supply 0.95V ~ 1.05V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
Manufacturer Microsemi Corporation Series SX-A Number of LABs/CLBs 1452 Number of Logic Elements/Cells - Total RAM Bits - Number of I/O 113 Number of Gates 24000 Voltage - Supply 2.25V ~ 5.25V Mounting Type Surface Mount Operating Temperature -40°C ~ 85°C (TA) Package / Case 144-LQFP Supplier Device Package 144-TQFP (20x20) |
Manufacturer Lattice Semiconductor Corporation Series SC Number of LABs/CLBs 3750 Number of Logic Elements/Cells 15000 Total RAM Bits 1054720 Number of I/O 300 Number of Gates - Voltage - Supply 0.95V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 105°C (TJ) Package / Case 900-BBGA Supplier Device Package 900-FPBGA (31x31) |
