M1AFS250-2FG256I
For Reference Only
| Part Number | M1AFS250-2FG256I |
| PNEDA Part # | M1AFS250-2FG256I |
| Description | IC FPGA 114 I/O 256FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 5,328 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 3 - May 8 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M1AFS250-2FG256I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M1AFS250-2FG256I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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Logistics Mode
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M1AFS250-2FG256I Specifications
| Manufacturer | Microsemi Corporation |
| Series | Fusion® |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 36864 |
| Number of I/O | 114 |
| Number of Gates | 250000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
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Manufacturer Xilinx Inc. Series XC4000E/X Number of LABs/CLBs 1024 Number of Logic Elements/Cells 2432 Total RAM Bits 32768 Number of I/O 160 Number of Gates 28000 Voltage - Supply 3V ~ 3.6V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 208-BFQFP Exposed Pad Supplier Device Package 208-PQFP (28x28) |
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Manufacturer Lattice Semiconductor Corporation Series ECP5 Number of LABs/CLBs 3000 Number of Logic Elements/Cells 12000 Total RAM Bits 589824 Number of I/O 197 Number of Gates - Voltage - Supply 1.045V ~ 1.155V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-LFBGA Supplier Device Package 256-CABGA (14x14) |
