M1AGL1000V2-FGG256I
For Reference Only
| Part Number | M1AGL1000V2-FGG256I |
| PNEDA Part # | M1AGL1000V2-FGG256I |
| Description | IC FPGA 177 I/O 256FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 2,214 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Apr 30 - May 5 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M1AGL1000V2-FGG256I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M1AGL1000V2-FGG256I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
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M1AGL1000V2-FGG256I Specifications
| Manufacturer | Microsemi Corporation |
| Series | IGLOO |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | 24576 |
| Total RAM Bits | 147456 |
| Number of I/O | 177 |
| Number of Gates | 1000000 |
| Voltage - Supply | 1.14V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
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Manufacturer Intel Series ACEX-1K® Number of LABs/CLBs 624 Number of Logic Elements/Cells 4992 Total RAM Bits 49152 Number of I/O 147 Number of Gates 257000 Voltage - Supply 2.375V ~ 2.625V Mounting Type Surface Mount Operating Temperature 0°C ~ 70°C (TA) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
Manufacturer Intel Series MAX® 10 Number of LABs/CLBs 250 Number of Logic Elements/Cells 4000 Total RAM Bits 193536 Number of I/O 101 Number of Gates - Voltage - Supply 2.85V ~ 3.465V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 144-LQFP Exposed Pad Supplier Device Package 144-EQFP (20x20) |
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Manufacturer Lattice Semiconductor Corporation Series XP Number of LABs/CLBs - Number of Logic Elements/Cells 6000 Total RAM Bits 73728 Number of I/O 188 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-BGA Supplier Device Package 256-FPBGA (17x17) |
