M2S010TS-VF256I
For Reference Only
| Part Number | M2S010TS-VF256I |
| PNEDA Part # | M2S010TS-VF256I |
| Description | IC SOC CORTEX-M3 166MHZ 256FBGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 3,472 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 29 - Jul 4 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M2S010TS-VF256I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M2S010TS-VF256I |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
Payment Method
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- Some orders may require a minimum amount of $100.00.
- Cheque or cash on delivery, processing may take an additional 3-5 days.
Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
- Tracking number will be sent once your order has been shipped.
- It may take up to 24 hours before carriers display the info.
Notes
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- Orders cannot be canceled after shipping the packages.
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M2S010TS-VF256I Specifications
| Manufacturer | Microsemi Corporation |
| Series | SmartFusion®2 |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 256KB |
| RAM Size | 64KB |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Speed | 166MHz |
| Primary Attributes | FPGA - 10K Logic Modules |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LFBGA |
| Supplier Device Package | 256-FPBGA (14x14) |
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Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 25K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 325-TFBGA, CSPBGA Supplier Device Package 325-CSPBGA (11x11) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EV Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 533MHz, 600MHz, 1.3GHz Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 900-BBGA, FCBGA Supplier Device Package 900-FCBGA (31x31) |
