M2S090-FCSG325
For Reference Only
| Part Number | M2S090-FCSG325 |
| PNEDA Part # | M2S090-FCSG325 |
| Description | IC SOC CORTEX-M3 166MHZ 325BGA |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 2,826 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 5 - May 10 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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M2S090-FCSG325 Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | M2S090-FCSG325 |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
Payment Method
- Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
- If you need the detailed invoice or tax ID,please email us.
- Some orders may require a minimum amount of $100.00.
- Cheque or cash on delivery, processing may take an additional 3-5 days.
Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
- Tracking number will be sent once your order has been shipped.
- It may take up to 24 hours before carriers display the info.
Notes
- Please confirm the specifications of the products when ordering.
- If you have special order instructions,please note it on the ordering pages.
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- You can email us to change the order details before shipment.
- Orders cannot be canceled after shipping the packages.
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M2S090-FCSG325 Specifications
| Manufacturer | Microsemi Corporation |
| Series | SmartFusion®2 |
| Architecture | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB |
| RAM Size | 64KB |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Speed | 166MHz |
| Primary Attributes | FPGA - 90K Logic Modules |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 325-TFBGA, CSPBGA |
| Supplier Device Package | 325-CSPBGA (11x11) |
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Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 512KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 90K Logic Modules Operating Temperature 0°C ~ 85°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
