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M82172G23

M82172G23

For Reference Only

Part Number M82172G23
PNEDA Part # M82172G23
Description IC ETH ROUTER BB SOC 2CH 672BGA
Manufacturer NXP
Unit Price Request a Quote
In Stock 4,752
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 18 - May 23 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

M82172G23 Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberM82172G23
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors

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  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
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Notes

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M82172G23 Specifications

ManufacturerNXP USA Inc.
Series*
Core Processor-
Number of Cores/Bus Width-
Speed-
Co-Processors/DSP-
RAM Controllers-
Graphics Acceleration-
Display & Interface Controllers-
Ethernet-
SATA-
USB-
Voltage - I/O-
Operating Temperature-
Security Features-
Package / Case-
Supplier Device Package-

The Products You May Be Interested In

Manufacturer

NXP USA Inc.

Series

MPC82xx

Core Processor

PowerPC G2_LE

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

300MHz

Co-Processors/DSP

Communications; RISC CPM

RAM Controllers

DRAM, SDRAM

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10/100Mbps (2)

SATA

-

USB

USB 2.0 (1)

Voltage - I/O

3.3V

Operating Temperature

-40°C ~ 105°C (TA)

Security Features

-

Package / Case

516-BBGA

Supplier Device Package

516-FPBGA (27x27)

Manufacturer

NXP USA Inc.

Series

MPC82xx

Core Processor

PowerPC G2

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

266MHz

Co-Processors/DSP

Communications; RISC CPM

RAM Controllers

DRAM, SDRAM

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10/100Mbps (3)

SATA

-

USB

-

Voltage - I/O

3.3V

Operating Temperature

0°C ~ 105°C (TA)

Security Features

-

Package / Case

480-LBGA Exposed Pad

Supplier Device Package

480-TBGA (37.5x37.5)

Manufacturer

NXP USA Inc.

Series

MPC83xx

Core Processor

PowerPC e300c4s

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

400MHz

Co-Processors/DSP

Security; SEC 3.0

RAM Controllers

DDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10/100/1000Mbps (2)

SATA

SATA 3Gbps (2)

USB

USB 2.0 + PHY (1)

Voltage - I/O

1.8V, 2.5V, 3.3V

Operating Temperature

0°C ~ 125°C (TA)

Security Features

Cryptography, Random Number Generator

Package / Case

689-BBGA Exposed Pad

Supplier Device Package

689-TEPBGA II (31x31)

Manufacturer

NXP USA Inc.

Series

MPC83xx

Core Processor

PowerPC e300

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

400MHz

Co-Processors/DSP

Communications; QUICC Engine

RAM Controllers

DDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10/100/1000Mbps (1)

SATA

-

USB

USB 1.x (1)

Voltage - I/O

1.8V, 2.5V, 3.3V

Operating Temperature

-40°C ~ 105°C (TA)

Security Features

-

Package / Case

740-LBGA

Supplier Device Package

740-TBGA (37.5x37.5)

Manufacturer

NXP USA Inc.

Series

i.MX6Q

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

4 Core, 32-Bit

Speed

1.2GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100/1000Mbps (1)

SATA

SATA 3Gbps (1)

USB

USB 2.0 + PHY (4)

Voltage - I/O

1.8V, 2.5V, 2.8V, 3.3V

Operating Temperature

-20°C ~ 105°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

624-LFBGA, FCBGA

Supplier Device Package

624-FCPBGA (21x21)

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