Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

MB90022PF-GS-176-BND

MB90022PF-GS-176-BND

For Reference Only

Part Number MB90022PF-GS-176-BND
PNEDA Part # MB90022PF-GS-176-BND
Description IC MCU 16B FFMC-16F-0.35 100QFP
Manufacturer Cypress Semiconductor
Unit Price Request a Quote
In Stock 4,140
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 19 - May 24 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

MB90022PF-GS-176-BND Resources

Brand Cypress Semiconductor
ECAD Module ECAD
Mfr. Part NumberMB90022PF-GS-176-BND
CategorySemiconductorsEmbedded Processors & ControllersMicrocontrollers

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • MB90022PF-GS-176-BND Datasheet
  • where to find MB90022PF-GS-176-BND
  • Cypress Semiconductor

  • Cypress Semiconductor MB90022PF-GS-176-BND
  • MB90022PF-GS-176-BND PDF Datasheet
  • MB90022PF-GS-176-BND Stock

  • MB90022PF-GS-176-BND Pinout
  • Datasheet MB90022PF-GS-176-BND
  • MB90022PF-GS-176-BND Supplier

  • Cypress Semiconductor Distributor
  • MB90022PF-GS-176-BND Price
  • MB90022PF-GS-176-BND Distributor

MB90022PF-GS-176-BND Specifications

ManufacturerCypress Semiconductor Corp
Series-
Core Processor-
Core Size-
Speed-
Connectivity-
Peripherals-
Number of I/O-
Program Memory Size-
Program Memory Type-
EEPROM Size-
RAM Size-
Voltage - Supply (Vcc/Vdd)-
Data Converters-
Oscillator Type-
Operating Temperature-
Mounting TypeSurface Mount
Package / Case100-BQFP
Supplier Device Package100-QFP (14x20)

The Products You May Be Interested In

PIC18F45Q10-I/MP

Microchip Technology

Manufacturer

Microchip Technology

Series

PIC® XLP™ 18Q

Core Processor

PIC

Core Size

8-Bit

Speed

16MHz

Connectivity

I²C, LINbus, SPI, UART/USART

Peripherals

Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT

Number of I/O

36

Program Memory Size

32KB (32K x 8)

Program Memory Type

FLASH

EEPROM Size

256 x 8

RAM Size

2.25K x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 5.5V

Data Converters

A/D 35x10b; D/A 1x5b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

40-VFQFN Exposed Pad

Supplier Device Package

40-QFN (5x5)

ATSAM4S8CB-CFN

Microchip Technology

Manufacturer

Microchip Technology

Series

SAM4S

Core Processor

ARM® Cortex®-M4

Core Size

32-Bit

Speed

120MHz

Connectivity

EBI/EMI, I²C, IrDA, Memory Card, SPI, SSC, UART/USART, USB

Peripherals

Brown-out Detect/Reset, DMA, POR, PWM, WDT

Number of I/O

79

Program Memory Size

512KB (512K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128K x 8

Voltage - Supply (Vcc/Vdd)

1.62V ~ 3.6V

Data Converters

A/D 16x12b; D/A 2x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount

Package / Case

100-VFBGA

Supplier Device Package

100-VFBGA (7x7)

R5F56108VDFP#V0

Renesas Electronics America

Manufacturer

Renesas Electronics America

Series

RX600

Core Processor

RX

Core Size

32-Bit

Speed

100MHz

Connectivity

EBI/EMI, I²C, SCI

Peripherals

DMA, POR, PWM, WDT

Number of I/O

117

Program Memory Size

2MB (2M x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128K x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 3.6V

Data Converters

A/D 16x10b; D/A 2x10b

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

100-LQFP

Supplier Device Package

100-LQFP (14x14)

Manufacturer

NXP USA Inc.

Series

Kinetis K10

Core Processor

ARM® Cortex®-M4

Core Size

32-Bit

Speed

120MHz

Connectivity

CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART

Peripherals

DMA, I²S, LVD, POR, PWM, WDT

Number of I/O

70

Program Memory Size

1MB (1M x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128K x 8

Voltage - Supply (Vcc/Vdd)

1.71V ~ 3.6V

Data Converters

A/D 66x16b; D/A 2x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount

Package / Case

144-LQFP

Supplier Device Package

144-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

HC08

Core Processor

HC08

Core Size

8-Bit

Speed

8MHz

Connectivity

-

Peripherals

LED, LVD, POR, PWM

Number of I/O

15

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

128 x 8

Voltage - Supply (Vcc/Vdd)

2.7V ~ 3.3V

Data Converters

A/D 12x8b

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Through Hole

Package / Case

20-DIP (0.300", 7.62mm)

Supplier Device Package

20-DIP

Recently Sold

MBRD1035CTLG

MBRD1035CTLG

ON Semiconductor

DIODE ARRAY SCHOTTKY 35V 5A DPAK

BLM18AG601SN1D

BLM18AG601SN1D

Murata

FERRITE BEAD 600 OHM 0603 1LN

MCP23017-E/SO

MCP23017-E/SO

Microchip Technology

IC I/O EXPANDER I2C 16B 28SOIC

FNM-30

FNM-30

Eaton - Bussmann Electrical Division

FUSE CARTRIDGE 30A 250VAC 5AG

IRG7PH42UDPBF

IRG7PH42UDPBF

Infineon Technologies

IGBT 1200V 85A 320W TO247AC

M24M01-RMN6P

M24M01-RMN6P

STMicroelectronics

IC EEPROM 1M I2C 1MHZ 8SO

AD8603AUJZ-REEL7

AD8603AUJZ-REEL7

Analog Devices

IC OPAMP GP 1 CIRCUIT TSOT5

MBRS340T3G

MBRS340T3G

ON Semiconductor

DIODE SCHOTTKY 40V 4A SMC

S29JL064J60TFI003

S29JL064J60TFI003

Cypress Semiconductor

IC FLASH 64M PARALLEL 48TSOP

IHLP1212BZER1R5M11

IHLP1212BZER1R5M11

Vishay Dale

FIXED IND 1.5UH 3.8A 32 MOHM SMD

STBB1-APUR

STBB1-APUR

STMicroelectronics

IC REG BCK BST ADJ 1.6A 10DFN

MLX90615SSG-DAA-000-TU

MLX90615SSG-DAA-000-TU

Melexis Technologies NV

SENSOR DGTL -40C-85C TO46-4