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MPC8271ZQPIEA

MPC8271ZQPIEA

For Reference Only

Part Number MPC8271ZQPIEA
PNEDA Part # MPC8271ZQPIEA
Description IC MPU MPC82XX 300MHZ 516BGA
Manufacturer NXP
Unit Price Request a Quote
In Stock 5,994
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 4 - May 9 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

MPC8271ZQPIEA Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberMPC8271ZQPIEA
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors
Datasheet
MPC8271ZQPIEA, MPC8271ZQPIEA Datasheet (Total Pages: 61, Size: 619 KB)
PDFMPC8272ZQTMFA Datasheet Cover
MPC8272ZQTMFA Datasheet Page 2 MPC8272ZQTMFA Datasheet Page 3 MPC8272ZQTMFA Datasheet Page 4 MPC8272ZQTMFA Datasheet Page 5 MPC8272ZQTMFA Datasheet Page 6 MPC8272ZQTMFA Datasheet Page 7 MPC8272ZQTMFA Datasheet Page 8 MPC8272ZQTMFA Datasheet Page 9 MPC8272ZQTMFA Datasheet Page 10 MPC8272ZQTMFA Datasheet Page 11

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  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
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  • Orders cannot be canceled after shipping the packages.

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MPC8271ZQPIEA Specifications

ManufacturerNXP USA Inc.
SeriesMPC82xx
Core ProcessorPowerPC G2_LE
Number of Cores/Bus Width1 Core, 32-Bit
Speed300MHz
Co-Processors/DSPCommunications; RISC CPM
RAM ControllersDRAM, SDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10/100Mbps (2)
SATA-
USBUSB 2.0 (1)
Voltage - I/O3.3V
Operating Temperature0°C ~ 105°C (TA)
Security Features-
Package / Case516-BBGA
Supplier Device Package516-FPBGA (27x27)

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Series

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Core Processor

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Number of Cores/Bus Width

1 Core, 32-Bit

Speed

50MHz

Co-Processors/DSP

Communications; CPM

RAM Controllers

DRAM

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10Mbps (1)

SATA

-

USB

USB 1.x (1)

Voltage - I/O

3.3V

Operating Temperature

-40°C ~ 95°C (TA)

Security Features

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Package / Case

256-BBGA

Supplier Device Package

256-PBGA (23x23)

Manufacturer

NXP USA Inc.

Series

i.MX1

Core Processor

ARM920T

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

150MHz

Co-Processors/DSP

-

RAM Controllers

SDRAM

Graphics Acceleration

No

Display & Interface Controllers

LCD, Touch Panel

Ethernet

-

SATA

-

USB

USB 1.x (1)

Voltage - I/O

1.8V, 3.0V

Operating Temperature

-30°C ~ 70°C (TA)

Security Features

-

Package / Case

256-MAPBGA

Supplier Device Package

-

Manufacturer

NXP USA Inc.

Series

MPC83xx

Core Processor

PowerPC e300

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

400MHz

Co-Processors/DSP

Communications; QUICC Engine

RAM Controllers

DDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10/100/1000Mbps (1)

SATA

-

USB

USB 1.x (1)

Voltage - I/O

1.8V, 2.5V, 3.3V

Operating Temperature

-40°C ~ 105°C (TA)

Security Features

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Package / Case

740-LBGA

Supplier Device Package

740-TBGA (37.5x37.5)

Manufacturer

NXP USA Inc.

Series

MPC8xx

Core Processor

MPC8xx

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

133MHz

Co-Processors/DSP

Communications; CPM

RAM Controllers

DRAM

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10Mbps (1), 10/100Mbps (1)

SATA

-

USB

-

Voltage - I/O

3.3V

Operating Temperature

0°C ~ 95°C (TA)

Security Features

-

Package / Case

357-BBGA

Supplier Device Package

357-PBGA (25x25)

Manufacturer

NXP USA Inc.

Series

MPC83xx

Core Processor

PowerPC e300c4s

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

667MHz

Co-Processors/DSP

Security; SEC 3.0

RAM Controllers

DDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10/100/1000Mbps (2)

SATA

-

USB

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Voltage - I/O

1.8V, 2.5V, 3.3V

Operating Temperature

-40°C ~ 125°C (TA)

Security Features

Cryptography, Random Number Generator

Package / Case

689-BBGA Exposed Pad

Supplier Device Package

689-TEPBGA II (31x31)

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