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MPC855TCZQ50D4R2

MPC855TCZQ50D4R2

For Reference Only

Part Number MPC855TCZQ50D4R2
PNEDA Part # MPC855TCZQ50D4R2
Description IC MPU MPC8XX 50MHZ 357BGA
Manufacturer NXP
Unit Price Request a Quote
In Stock 4,464
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 1 - May 6 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

MPC855TCZQ50D4R2 Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberMPC855TCZQ50D4R2
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors
Datasheet
MPC855TCZQ50D4R2, MPC855TCZQ50D4R2 Datasheet (Total Pages: 77, Size: 1,044 KB)
PDFMPC860SRZQ66D4R2 Datasheet Cover
MPC860SRZQ66D4R2 Datasheet Page 2 MPC860SRZQ66D4R2 Datasheet Page 3 MPC860SRZQ66D4R2 Datasheet Page 4 MPC860SRZQ66D4R2 Datasheet Page 5 MPC860SRZQ66D4R2 Datasheet Page 6 MPC860SRZQ66D4R2 Datasheet Page 7 MPC860SRZQ66D4R2 Datasheet Page 8 MPC860SRZQ66D4R2 Datasheet Page 9 MPC860SRZQ66D4R2 Datasheet Page 10 MPC860SRZQ66D4R2 Datasheet Page 11

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MPC855TCZQ50D4R2 Specifications

ManufacturerNXP USA Inc.
SeriesMPC8xx
Core ProcessorMPC8xx
Number of Cores/Bus Width1 Core, 32-Bit
Speed50MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10Mbps (1), 10/100Mbps (1)
SATA-
USB-
Voltage - I/O3.3V
Operating Temperature-40°C ~ 95°C (TA)
Security Features-
Package / Case357-BBGA
Supplier Device Package357-PBGA (25x25)

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Operating Temperature

-40°C ~ 105°C (TA)

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369-LFBGA

Supplier Device Package

369-PBGA (19x19)

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