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MPC855TZQ50D4

MPC855TZQ50D4

For Reference Only

Part Number MPC855TZQ50D4
PNEDA Part # MPC855TZQ50D4
Description IC MPU MPC8XX 50MHZ 357BGA
Manufacturer NXP
Unit Price Request a Quote
In Stock 4,662
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 12 - May 17 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

MPC855TZQ50D4 Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberMPC855TZQ50D4
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors
Datasheet
MPC855TZQ50D4, MPC855TZQ50D4 Datasheet (Total Pages: 77, Size: 1,044 KB)
PDFMPC860SRZQ66D4R2 Datasheet Cover
MPC860SRZQ66D4R2 Datasheet Page 2 MPC860SRZQ66D4R2 Datasheet Page 3 MPC860SRZQ66D4R2 Datasheet Page 4 MPC860SRZQ66D4R2 Datasheet Page 5 MPC860SRZQ66D4R2 Datasheet Page 6 MPC860SRZQ66D4R2 Datasheet Page 7 MPC860SRZQ66D4R2 Datasheet Page 8 MPC860SRZQ66D4R2 Datasheet Page 9 MPC860SRZQ66D4R2 Datasheet Page 10 MPC860SRZQ66D4R2 Datasheet Page 11

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MPC855TZQ50D4 Specifications

ManufacturerNXP USA Inc.
SeriesMPC8xx
Core ProcessorMPC8xx
Number of Cores/Bus Width1 Core, 32-Bit
Speed50MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10Mbps (1), 10/100Mbps (1)
SATA-
USB-
Voltage - I/O3.3V
Operating Temperature0°C ~ 95°C (TA)
Security Features-
Package / Case357-BBGA
Supplier Device Package357-PBGA (25x25)

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Number of Cores/Bus Width

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RAM Controllers

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Operating Temperature

0°C ~ 70°C (TA)

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Package / Case

256-LFBGA

Supplier Device Package

256-PBGA (17x17)

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