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MPC860ENZQ50D4

MPC860ENZQ50D4

For Reference Only

Part Number MPC860ENZQ50D4
PNEDA Part # MPC860ENZQ50D4
Description IC MPU MPC8XX 50MHZ 357BGA
Manufacturer NXP
Unit Price Request a Quote
In Stock 7,884
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 18 - May 23 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

MPC860ENZQ50D4 Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberMPC860ENZQ50D4
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors
Datasheet
MPC860ENZQ50D4, MPC860ENZQ50D4 Datasheet (Total Pages: 77, Size: 1,044 KB)
PDFMPC860SRZQ66D4R2 Datasheet Cover
MPC860SRZQ66D4R2 Datasheet Page 2 MPC860SRZQ66D4R2 Datasheet Page 3 MPC860SRZQ66D4R2 Datasheet Page 4 MPC860SRZQ66D4R2 Datasheet Page 5 MPC860SRZQ66D4R2 Datasheet Page 6 MPC860SRZQ66D4R2 Datasheet Page 7 MPC860SRZQ66D4R2 Datasheet Page 8 MPC860SRZQ66D4R2 Datasheet Page 9 MPC860SRZQ66D4R2 Datasheet Page 10 MPC860SRZQ66D4R2 Datasheet Page 11

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MPC860ENZQ50D4 Specifications

ManufacturerNXP USA Inc.
SeriesMPC8xx
Core ProcessorMPC8xx
Number of Cores/Bus Width1 Core, 32-Bit
Speed50MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10Mbps (4)
SATA-
USB-
Voltage - I/O3.3V
Operating Temperature0°C ~ 95°C (TA)
Security Features-
Package / Case357-BBGA
Supplier Device Package357-PBGA (25x25)

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Core Processor

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Number of Cores/Bus Width

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Co-Processors/DSP

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0°C ~ 70°C (TA)

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Number of Cores/Bus Width

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SATA

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1.8V, 2.5V, 3.3V

Operating Temperature

0°C ~ 105°C (TA)

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Package / Case

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Supplier Device Package

620-PBGA (29x29)

Manufacturer

NXP USA Inc.

Series

MPC8xx

Core Processor

MPC8xx

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

50MHz

Co-Processors/DSP

Communications; CPM

RAM Controllers

DRAM

Graphics Acceleration

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Display & Interface Controllers

-

Ethernet

10Mbps (1)

SATA

-

USB

USB 1.x (1)

Voltage - I/O

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Operating Temperature

0°C ~ 95°C (TA)

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Package / Case

256-BBGA

Supplier Device Package

256-PBGA (23x23)

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NXP USA Inc.

Series

i.MX6SX

Core Processor

ARM® Cortex®-A9, ARM® Cortex®-M4

Number of Cores/Bus Width

2 Core, 32-Bit

Speed

200MHz, 800MHz

Co-Processors/DSP

Multimedia; NEON™ MPE

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

No

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100/1000Mbps (2)

SATA

-

USB

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

Voltage - I/O

1.8V, 2.5V, 2.8V, 3.15V

Operating Temperature

-40°C ~ 125°C (TJ)

Security Features

A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE

Package / Case

400-LFBGA

Supplier Device Package

400-MAPBGA (17x17)

Manufacturer

NXP USA Inc.

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Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

2 Core, 32-Bit

Speed

800MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100/1000Mbps (1)

SATA

-

USB

USB 2.0 + PHY (4)

Voltage - I/O

1.8V, 2.5V, 2.8V, 3.3V

Operating Temperature

-40°C ~ 125°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Package / Case

624-LFBGA

Supplier Device Package

624-MAPBGA (21x21)

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