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OMAP3530ECBB72

OMAP3530ECBB72

For Reference Only

Part Number OMAP3530ECBB72
PNEDA Part # OMAP3530ECBB72
Description IC MPU OMAP-35XX 720MHZ 515FCBGA
Manufacturer Texas Instruments
Unit Price Request a Quote
In Stock 4,608
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 26 - Jul 1 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

OMAP3530ECBB72 Resources

Brand Texas Instruments
ECAD Module ECAD
Mfr. Part NumberOMAP3530ECBB72
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors

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OMAP3530ECBB72 Specifications

Manufacturer
SeriesOMAP-35xx
Core ProcessorARM® Cortex®-A8
Number of Cores/Bus Width1 Core, 32-Bit
Speed720MHz
Co-Processors/DSPSignal Processing; C64x+, Multimedia; NEON™ SIMD
RAM ControllersLPDDR
Graphics AccelerationYes
Display & Interface ControllersLCD
Ethernet-
SATA-
USBUSB 1.x (3), USB 2.0 (1)
Voltage - I/O1.8V, 3.0V
Operating Temperature0°C ~ 90°C (TJ)
Security Features-
Package / Case515-VFBGA, FCBGA
Supplier Device Package515-POP-FCBGA (12x12)

The Products You May Be Interested In

OMAP3530DCBB72

Texas Instruments

Manufacturer

Series

OMAP-35xx

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

720MHz

Co-Processors/DSP

Signal Processing; C64x+, Multimedia; NEON™ SIMD

RAM Controllers

LPDDR

Graphics Acceleration

Yes

Display & Interface Controllers

LCD

Ethernet

-

SATA

-

USB

USB 1.x (3), USB 2.0 (1)

Voltage - I/O

1.8V, 3.0V

Operating Temperature

0°C ~ 90°C (TJ)

Security Features

-

Package / Case

515-VFBGA, FCBGA

Supplier Device Package

515-POP-FCBGA (12x12)

Manufacturer

NXP USA Inc.

Series

*

Core Processor

-

Number of Cores/Bus Width

-

Speed

-

Co-Processors/DSP

-

RAM Controllers

-

Graphics Acceleration

-

Display & Interface Controllers

-

Ethernet

-

SATA

-

USB

-

Voltage - I/O

-

Operating Temperature

-

Security Features

-

Package / Case

516-BBGA Exposed Pad

Supplier Device Package

516-TEPBGA (27x27)

PCX755BVZFU350LE

Microchip Technology

Manufacturer

Microchip Technology

Series

-

Core Processor

PowerPC

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

350MHz

Co-Processors/DSP

-

RAM Controllers

-

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

-

SATA

-

USB

-

Voltage - I/O

2.5V, 3.3V

Operating Temperature

-40°C ~ 110°C (TJ)

Security Features

-

Package / Case

360-BBGA Exposed Pad

Supplier Device Package

360-PBGA (25x25)

Manufacturer

NXP USA Inc.

Series

MPC8xx

Core Processor

MPC8xx

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

133MHz

Co-Processors/DSP

Communications; CPM

RAM Controllers

DRAM

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10Mbps (4), 10/100Mbps (1)

SATA

-

USB

-

Voltage - I/O

3.3V

Operating Temperature

0°C ~ 95°C (TA)

Security Features

-

Package / Case

357-BBGA

Supplier Device Package

357-PBGA (25x25)

Manufacturer

NXP USA Inc.

Series

QorIQ® Layerscape

Core Processor

ARM® Cortex®-A53

Number of Cores/Bus Width

4 Core, 64-Bit

Speed

1.0GHz

Co-Processors/DSP

-

RAM Controllers

DDR3L, DDR4

Graphics Acceleration

-

Display & Interface Controllers

-

Ethernet

1GbE (7) or 10GbE (1) & 1GbE (5)

SATA

SATA 6Gbps (1)

USB

USB 3.0 (3) + PHY

Voltage - I/O

-

Operating Temperature

0°C ~ 105°C

Security Features

Secure Boot, TrustZone®

Package / Case

621-FBGA, FCBGA

Supplier Device Package

621-FCPBGA (21x21)

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