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P5010NSE7QMB

P5010NSE7QMB

For Reference Only

Part Number P5010NSE7QMB
PNEDA Part # P5010NSE7QMB
Description IC MPU Q OR IQ 2.0GHZ 1295FCBGA
Manufacturer NXP
Unit Price Request a Quote
In Stock 7,272
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 18 - Jun 23 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

P5010NSE7QMB Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberP5010NSE7QMB
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors
Datasheet
P5010NSE7QMB, P5010NSE7QMB Datasheet (Total Pages: 2, Size: 154.18 KB)
PDFP5020NXN7VNB Datasheet Cover
P5020NXN7VNB Datasheet Page 2

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P5010NSE7QMB Specifications

ManufacturerNXP USA Inc.
SeriesQorIQ P5
Core ProcessorPowerPC e5500
Number of Cores/Bus Width1 Core, 64-Bit
Speed2.0GHz
Co-Processors/DSPSecurity; SEC 4.2
RAM ControllersDDR3, DDR3L
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet1Gbps (5), 10Gbps (1)
SATASATA 3Gbps (2)
USBUSB 2.0 + PHY (2)
Voltage - I/O-
Operating Temperature0°C ~ 105°C (TA)
Security FeaturesBoot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Package / Case1295-BBGA, FCBGA
Supplier Device Package1295-FCPBGA (37.5x37.5)

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Series

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Core Processor

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Number of Cores/Bus Width

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Speed

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Co-Processors/DSP

-

RAM Controllers

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Graphics Acceleration

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Display & Interface Controllers

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Ethernet

10/100/1000Mbps (2)

SATA

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USB

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Voltage - I/O

1.8V, 2.5V, 3.3V

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-40°C ~ 105°C (TA)

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Number of Cores/Bus Width

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Voltage - I/O

5.0V

Operating Temperature

-40°C ~ 100°C (TA)

Security Features

-

Package / Case

64-DIP (0.750", 19.05mm)

Supplier Device Package

64-DIP

Manufacturer

NXP USA Inc.

Series

QorIQ® Layerscape

Core Processor

ARM® Cortex®-A72

Number of Cores/Bus Width

4 Core, 64-Bit

Speed

1.4GHz

Co-Processors/DSP

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RAM Controllers

DDR4

Graphics Acceleration

-

Display & Interface Controllers

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Ethernet

10GbE (2), 2.5GbE (1), 1GbE (4)

SATA

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USB

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Voltage - I/O

-

Operating Temperature

0°C ~ 105°C

Security Features

Secure Boot, TrustZone®

Package / Case

780-FBGA, FCBGA

Supplier Device Package

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Manufacturer

NXP USA Inc.

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Number of Cores/Bus Width

1 Core, 32-Bit

Speed

400MHz

Co-Processors/DSP

Security; SEC 3.0

RAM Controllers

DDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10/100/1000Mbps (2)

SATA

-

USB

USB 2.0 + PHY (1)

Voltage - I/O

1.8V, 2.5V, 3.3V

Operating Temperature

0°C ~ 125°C (TA)

Security Features

Cryptography, Random Number Generator

Package / Case

689-BBGA Exposed Pad

Supplier Device Package

689-TEPBGA II (31x31)

Manufacturer

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Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

4 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, DDR3L, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel

Ethernet

10/100/1000Mbps (1)

SATA

SATA 3Gbps (1)

USB

USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)

Voltage - I/O

1.8V, 2.5V, 2.8V, 3.3V

Operating Temperature

-40°C ~ 125°C (TJ)

Security Features

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

Package / Case

624-FBGA, FCBGA

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