SI8662BB-B-IS1
For Reference Only
| Part Number | SI8662BB-B-IS1 |
| PNEDA Part # | SI8662BB-B-IS1 |
| Description | DGTL ISO 2.5KV GEN PURP 16SOIC |
| Manufacturer | Silicon Labs |
| Unit Price | Request a Quote |
| In Stock | 29,184 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 13 - May 18 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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SI8662BB-B-IS1 Resources
| Brand | Silicon Labs |
| ECAD Module |
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| Mfr. Part Number | SI8662BB-B-IS1 |
| Category | Semiconductors › Isolators › Digital Isolators |
| Datasheet |
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Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
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Notes
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SI8662BB-B-IS1 Specifications
| Manufacturer | Silicon Labs |
| Series | - |
| Technology | Capacitive Coupling |
| Type | General Purpose |
| Isolated Power | No |
| Number of Channels | 6 |
| Inputs - Side 1/Side 2 | 4/2 |
| Channel Type | Unidirectional |
| Voltage - Isolation | 2500Vrms |
| Common Mode Transient Immunity (Min) | 35kV/µs |
| Data Rate | 150Mbps |
| Propagation Delay tpLH / tpHL (Max) | 13ns, 13ns |
| Pulse Width Distortion (Max) | 4.5ns |
| Rise / Fall Time (Typ) | 2.5ns, 2.5ns |
| Voltage - Supply | 2.5V ~ 5.5V |
| Operating Temperature | -40°C ~ 125°C |
| Mounting Type | Surface Mount |
| Package / Case | 16-SOIC (0.154", 3.90mm Width) |
| Supplier Device Package | 16-SOIC |
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Manufacturer Analog Devices Inc. Series Automotive Technology Magnetic Coupling Type General Purpose Isolated Power No Number of Channels 2 Inputs - Side 1/Side 2 1/1 Channel Type Unidirectional Voltage - Isolation 2500Vrms Common Mode Transient Immunity (Min) 25kV/µs Data Rate 25Mbps Propagation Delay tpLH / tpHL (Max) 45ns, 45ns Pulse Width Distortion (Max) 3ns Rise / Fall Time (Typ) 2.5ns, 2.5ns Voltage - Supply 3V ~ 5.5V Operating Temperature -40°C ~ 125°C Mounting Type Surface Mount Package / Case 8-SOIC (0.154", 3.90mm Width) Supplier Device Package 8-SOIC |
