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TH58BYG2S3HBAI4

TH58BYG2S3HBAI4

For Reference Only

Part Number TH58BYG2S3HBAI4
PNEDA Part # TH58BYG2S3HBAI4
Description 4G SLC NAND BGA 24NM
Manufacturer Toshiba Memory America, Inc.
Unit Price Request a Quote
In Stock 7,272
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jul 13 - Jul 18 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

TH58BYG2S3HBAI4 Resources

Brand Toshiba Memory America, Inc.
ECAD Module ECAD
Mfr. Part NumberTH58BYG2S3HBAI4
CategorySemiconductorsMemory ICsMemory

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TH58BYG2S3HBAI4 Specifications

ManufacturerToshiba Memory America, Inc.
SeriesBenand™
Memory TypeNon-Volatile
Memory FormatFLASH
TechnologyFLASH - NAND (SLC)
Memory Size4Gb (512M x 8)
Memory Interface-
Clock Frequency-
Write Cycle Time - Word, Page-
Access Time-
Voltage - Supply-
Operating Temperature-40°C ~ 85°C
Mounting TypeSurface Mount
Package / Case63-VFBGA
Supplier Device Package63-TFBGA (9x11)

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