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W25M512JVBIQ

W25M512JVBIQ

For Reference Only

Part Number W25M512JVBIQ
PNEDA Part # W25M512JVBIQ
Description IC FLASH 512M SPI 24TFBGA
Manufacturer Winbond Electronics
Unit Price Request a Quote
In Stock 2,592
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 26 - Jul 1 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

W25M512JVBIQ Resources

Brand Winbond Electronics
ECAD Module ECAD
Mfr. Part NumberW25M512JVBIQ
CategorySemiconductorsMemory ICsMemory
Datasheet
W25M512JVBIQ, W25M512JVBIQ Datasheet (Total Pages: 91, Size: 1,530.77 KB)
PDFW25M512JVEIQ Datasheet Cover
W25M512JVEIQ Datasheet Page 2 W25M512JVEIQ Datasheet Page 3 W25M512JVEIQ Datasheet Page 4 W25M512JVEIQ Datasheet Page 5 W25M512JVEIQ Datasheet Page 6 W25M512JVEIQ Datasheet Page 7 W25M512JVEIQ Datasheet Page 8 W25M512JVEIQ Datasheet Page 9 W25M512JVEIQ Datasheet Page 10 W25M512JVEIQ Datasheet Page 11

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W25M512JVBIQ Specifications

ManufacturerWinbond Electronics
SeriesSpiFlash®
Memory TypeNon-Volatile
Memory FormatFLASH
TechnologyFLASH - NOR
Memory Size512Mb (64M x 8)
Memory InterfaceSPI
Clock Frequency104MHz
Write Cycle Time - Word, Page-
Access Time-
Voltage - Supply2.7V ~ 3.6V
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case24-TBGA
Supplier Device Package24-TFBGA (6x8)

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