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W25Q256FVBIP

W25Q256FVBIP

For Reference Only

Part Number W25Q256FVBIP
PNEDA Part # W25Q256FVBIP
Description IC FLASH 256M SPI 24TFBGA
Manufacturer Winbond Electronics
Unit Price Request a Quote
In Stock 5,688
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 15 - May 20 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

W25Q256FVBIP Resources

Brand Winbond Electronics
ECAD Module ECAD
Mfr. Part NumberW25Q256FVBIP
CategorySemiconductorsMemory ICsMemory
Datasheet
W25Q256FVBIP, W25Q256FVBIP Datasheet (Total Pages: 108, Size: 1,093.92 KB)
PDFW25Q256FVEIP Datasheet Cover
W25Q256FVEIP Datasheet Page 2 W25Q256FVEIP Datasheet Page 3 W25Q256FVEIP Datasheet Page 4 W25Q256FVEIP Datasheet Page 5 W25Q256FVEIP Datasheet Page 6 W25Q256FVEIP Datasheet Page 7 W25Q256FVEIP Datasheet Page 8 W25Q256FVEIP Datasheet Page 9 W25Q256FVEIP Datasheet Page 10 W25Q256FVEIP Datasheet Page 11

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W25Q256FVBIP Specifications

ManufacturerWinbond Electronics
SeriesSpiFlash®
Memory TypeNon-Volatile
Memory FormatFLASH
TechnologyFLASH - NOR
Memory Size256Mb (32M x 8)
Memory InterfaceSPI - Quad I/O, QPI
Clock Frequency104MHz
Write Cycle Time - Word, Page50µs, 3ms
Access Time-
Voltage - Supply2.7V ~ 3.6V
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case24-TBGA
Supplier Device Package24-TFBGA (6x8)

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