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W25Q256FVCIG

W25Q256FVCIG

For Reference Only

Part Number W25Q256FVCIG
PNEDA Part # W25Q256FVCIG
Description IC FLASH 256M SPI 24TFBGA
Manufacturer Winbond Electronics
Unit Price Request a Quote
In Stock 8,370
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 1 - May 6 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

W25Q256FVCIG Resources

Brand Winbond Electronics
ECAD Module ECAD
Mfr. Part NumberW25Q256FVCIG
CategorySemiconductorsMemory ICsMemory
Datasheet
W25Q256FVCIG, W25Q256FVCIG Datasheet (Total Pages: 109, Size: 2,797.65 KB)
PDFW25Q256FVFJQ Datasheet Cover
W25Q256FVFJQ Datasheet Page 2 W25Q256FVFJQ Datasheet Page 3 W25Q256FVFJQ Datasheet Page 4 W25Q256FVFJQ Datasheet Page 5 W25Q256FVFJQ Datasheet Page 6 W25Q256FVFJQ Datasheet Page 7 W25Q256FVFJQ Datasheet Page 8 W25Q256FVFJQ Datasheet Page 9 W25Q256FVFJQ Datasheet Page 10 W25Q256FVFJQ Datasheet Page 11

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W25Q256FVCIG Specifications

ManufacturerWinbond Electronics
SeriesSpiFlash®
Memory TypeNon-Volatile
Memory FormatFLASH
TechnologyFLASH - NOR
Memory Size256Mb (32M x 8)
Memory InterfaceSPI - Quad I/O, QPI
Clock Frequency104MHz
Write Cycle Time - Word, Page50µs, 3ms
Access Time-
Voltage - Supply2.7V ~ 3.6V
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case24-TBGA
Supplier Device Package24-TFBGA (6x8)

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