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W25Q32BVSSJP

W25Q32BVSSJP

For Reference Only

Part Number W25Q32BVSSJP
PNEDA Part # W25Q32BVSSJP
Description IC FLASH MEMORY 32MB
Manufacturer Winbond Electronics
Unit Price Request a Quote
In Stock 7,794
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 23 - Jun 28 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

W25Q32BVSSJP Resources

Brand Winbond Electronics
ECAD Module ECAD
Mfr. Part NumberW25Q32BVSSJP
CategorySemiconductorsMemory ICsMemory
Datasheet
W25Q32BVSSJP, W25Q32BVSSJP Datasheet (Total Pages: 78, Size: 1,092.81 KB)
PDFW25Q32BVZPJP Datasheet Cover
W25Q32BVZPJP Datasheet Page 2 W25Q32BVZPJP Datasheet Page 3 W25Q32BVZPJP Datasheet Page 4 W25Q32BVZPJP Datasheet Page 5 W25Q32BVZPJP Datasheet Page 6 W25Q32BVZPJP Datasheet Page 7 W25Q32BVZPJP Datasheet Page 8 W25Q32BVZPJP Datasheet Page 9 W25Q32BVZPJP Datasheet Page 10 W25Q32BVZPJP Datasheet Page 11

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W25Q32BVSSJP Specifications

ManufacturerWinbond Electronics
SeriesSpiFlash®
Memory TypeNon-Volatile
Memory FormatFLASH
TechnologyFLASH - NOR
Memory Size32Mb (4M x 8)
Memory InterfaceSPI - Quad I/O
Clock Frequency104MHz
Write Cycle Time - Word, Page50µs, 3ms
Access Time-
Voltage - Supply2.7V ~ 3.6V
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount
Package / Case8-SOIC (0.209", 5.30mm Width)
Supplier Device Package8-SOIC

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