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W978H6KBQX2E

W978H6KBQX2E

For Reference Only

Part Number W978H6KBQX2E
PNEDA Part # W978H6KBQX2E
Description IC DRAM 256M PARALLEL 168WFBGA
Manufacturer Winbond Electronics
Unit Price Request a Quote
In Stock 7,326
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 17 - Jun 22 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

W978H6KBQX2E Resources

Brand Winbond Electronics
ECAD Module ECAD
Mfr. Part NumberW978H6KBQX2E
CategorySemiconductorsMemory ICsMemory
Datasheet
W978H6KBQX2E, W978H6KBQX2E Datasheet (Total Pages: 122, Size: 4,121.3 KB)
PDFW978H6KBQX2I Datasheet Cover
W978H6KBQX2I Datasheet Page 2 W978H6KBQX2I Datasheet Page 3 W978H6KBQX2I Datasheet Page 4 W978H6KBQX2I Datasheet Page 5 W978H6KBQX2I Datasheet Page 6 W978H6KBQX2I Datasheet Page 7 W978H6KBQX2I Datasheet Page 8 W978H6KBQX2I Datasheet Page 9 W978H6KBQX2I Datasheet Page 10 W978H6KBQX2I Datasheet Page 11

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W978H6KBQX2E Specifications

ManufacturerWinbond Electronics
Series-
Memory TypeVolatile
Memory FormatDRAM
TechnologySDRAM - Mobile LPDDR2
Memory Size256Mb (16M x 16)
Memory InterfaceParallel
Clock Frequency400MHz
Write Cycle Time - Word, Page15ns
Access Time-
Voltage - Supply1.14V ~ 1.95V
Operating Temperature-25°C ~ 85°C (TC)
Mounting TypeSurface Mount
Package / Case168-WFBGA
Supplier Device Package168-WFBGA (12x12)

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