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XA7Z020-1CLG400Q

XA7Z020-1CLG400Q

For Reference Only

Part Number XA7Z020-1CLG400Q
PNEDA Part # XA7Z020-1CLG400Q
Description IC SOC CORTEX-A9 667MHZ 400BGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 203
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 12 - Jun 17 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XA7Z020-1CLG400Q Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXA7Z020-1CLG400Q
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XA7Z020-1CLG400Q, XA7Z020-1CLG400Q Datasheet (Total Pages: 28, Size: 825.14 KB)
PDFXA7Z030-1FBG484I Datasheet Cover
XA7Z030-1FBG484I Datasheet Page 2 XA7Z030-1FBG484I Datasheet Page 3 XA7Z030-1FBG484I Datasheet Page 4 XA7Z030-1FBG484I Datasheet Page 5 XA7Z030-1FBG484I Datasheet Page 6 XA7Z030-1FBG484I Datasheet Page 7 XA7Z030-1FBG484I Datasheet Page 8 XA7Z030-1FBG484I Datasheet Page 9 XA7Z030-1FBG484I Datasheet Page 10 XA7Z030-1FBG484I Datasheet Page 11

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XA7Z020-1CLG400Q Specifications

ManufacturerXilinx Inc.
SeriesAutomotive, AEC-Q100, Zynq®-7000 XA
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesArtix™-7 FPGA, 85K Logic Cells
Operating Temperature-40°C ~ 125°C (TJ)
Package / Case400-LFBGA, CSPBGA
Supplier Device Package400-CSPBGA (17x17)

The Products You May Be Interested In

Manufacturer

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Series

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Architecture

MCU, FPGA

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Flash Size

-

RAM Size

256KB

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

667MHz

Primary Attributes

Artix™-7 FPGA, 85K Logic Cells

Operating Temperature

-40°C ~ 125°C (TJ)

Package / Case

484-LFBGA, CSPBGA

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CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

800MHz

Primary Attributes

FPGA - 40K Logic Elements

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

484-FBGA

Supplier Device Package

484-UBGA (19x19)

M2S025TS-VF400

Microsemi

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Microsemi Corporation

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SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

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256KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

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Primary Attributes

FPGA - 25K Logic Modules

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Package / Case

400-LFBGA

Supplier Device Package

400-VFBGA (17x17)

Manufacturer

Intel

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Cyclone® V SE

Architecture

MCU, FPGA

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Single ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

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Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

600MHz

Primary Attributes

FPGA - 85K Logic Elements

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

672-FBGA

Supplier Device Package

672-UBGA (23x23)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

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RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 600MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

784-BFBGA, FCBGA

Supplier Device Package

784-FCBGA (23x23)

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