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XC2S100-5FGG256I

XC2S100-5FGG256I

For Reference Only

Part Number XC2S100-5FGG256I
PNEDA Part # XC2S100-5FGG256I
Description IC FPGA 176 I/O 256FBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 4,644
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 20 - May 25 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XC2S100-5FGG256I Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXC2S100-5FGG256I
CategorySemiconductorsEmbedded Processors & ControllersFPGAs (Field Programmable Gate Array)
Datasheet
XC2S100-5FGG256I, XC2S100-5FGG256I Datasheet (Total Pages: 99, Size: 1,009.44 KB)
PDFXC2S30-6PQ208C Datasheet Cover
XC2S30-6PQ208C Datasheet Page 2 XC2S30-6PQ208C Datasheet Page 3 XC2S30-6PQ208C Datasheet Page 4 XC2S30-6PQ208C Datasheet Page 5 XC2S30-6PQ208C Datasheet Page 6 XC2S30-6PQ208C Datasheet Page 7 XC2S30-6PQ208C Datasheet Page 8 XC2S30-6PQ208C Datasheet Page 9 XC2S30-6PQ208C Datasheet Page 10 XC2S30-6PQ208C Datasheet Page 11

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XC2S100-5FGG256I Specifications

ManufacturerXilinx Inc.
SeriesSpartan®-II
Number of LABs/CLBs600
Number of Logic Elements/Cells2700
Total RAM Bits40960
Number of I/O176
Number of Gates100000
Voltage - Supply2.375V ~ 2.625V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case256-BGA
Supplier Device Package256-FBGA (17x17)

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Manufacturer

Xilinx Inc.

Series

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Number of LABs/CLBs

216

Number of Logic Elements/Cells

972

Total RAM Bits

24576

Number of I/O

92

Number of Gates

30000

Voltage - Supply

2.375V ~ 2.625V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

144-LQFP

Supplier Device Package

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EP4CE15M9I7N

Intel

Manufacturer

Intel

Series

Cyclone® IV E

Number of LABs/CLBs

963

Number of Logic Elements/Cells

15408

Total RAM Bits

516096

Number of I/O

165

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

256-TFBGA

Supplier Device Package

256-MBGA (9x9)

LFXP6C-3FN256I

Lattice Semiconductor Corporation

Manufacturer

Lattice Semiconductor Corporation

Series

XP

Number of LABs/CLBs

-

Number of Logic Elements/Cells

6000

Total RAM Bits

73728

Number of I/O

188

Number of Gates

-

Voltage - Supply

1.71V ~ 3.465V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

256-BGA

Supplier Device Package

256-FPBGA (17x17)

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

250

Number of Logic Elements/Cells

4000

Total RAM Bits

193536

Number of I/O

246

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

-40°C ~ 125°C (TJ)

Package / Case

324-LFBGA

Supplier Device Package

324-UBGA (15x15)

AFS1500-2FG676

Microsemi

Manufacturer

Microsemi Corporation

Series

Fusion®

Number of LABs/CLBs

-

Number of Logic Elements/Cells

-

Total RAM Bits

276480

Number of I/O

252

Number of Gates

1500000

Voltage - Supply

1.425V ~ 1.575V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

676-BGA

Supplier Device Package

676-FBGA (27x27)

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