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XC3S1400AN-4FGG676I

XC3S1400AN-4FGG676I

For Reference Only

Part Number XC3S1400AN-4FGG676I
PNEDA Part # XC3S1400AN-4FGG676I
Description IC FPGA 502 I/O 676FBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 14,309
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 26 - Jul 1 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XC3S1400AN-4FGG676I Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXC3S1400AN-4FGG676I
CategorySemiconductorsEmbedded Processors & ControllersFPGAs (Field Programmable Gate Array)
Datasheet
XC3S1400AN-4FGG676I, XC3S1400AN-4FGG676I Datasheet (Total Pages: 123, Size: 3,707.3 KB)
PDFXC3S50AN-5FT256C Datasheet Cover
XC3S50AN-5FT256C Datasheet Page 2 XC3S50AN-5FT256C Datasheet Page 3 XC3S50AN-5FT256C Datasheet Page 4 XC3S50AN-5FT256C Datasheet Page 5 XC3S50AN-5FT256C Datasheet Page 6 XC3S50AN-5FT256C Datasheet Page 7 XC3S50AN-5FT256C Datasheet Page 8 XC3S50AN-5FT256C Datasheet Page 9 XC3S50AN-5FT256C Datasheet Page 10 XC3S50AN-5FT256C Datasheet Page 11

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XC3S1400AN-4FGG676I Specifications

ManufacturerXilinx Inc.
SeriesSpartan®-3AN
Number of LABs/CLBs2816
Number of Logic Elements/Cells25344
Total RAM Bits589824
Number of I/O502
Number of Gates1400000
Voltage - Supply1.14V ~ 1.26V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BGA
Supplier Device Package676-FBGA (27x27)

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Supplier Device Package

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Manufacturer

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Number of LABs/CLBs

3005

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60100

Total RAM Bits

2528640

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Voltage - Supply

1.15V ~ 1.25V

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Manufacturer

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Voltage - Supply

2.375V ~ 2.625V

Mounting Type

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Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

676-BBGA, FCBGA

Supplier Device Package

676-FCBGA (27x27)

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