XC3S2000-4FGG900I
For Reference Only
| Part Number | XC3S2000-4FGG900I |
| PNEDA Part # | XC3S2000-4FGG900I |
| Description | IC FPGA 565 I/O 900FBGA |
| Manufacturer | Xilinx |
| Unit Price | Request a Quote |
| In Stock | 6,192 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 23 - May 28 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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XC3S2000-4FGG900I Resources
| Brand | Xilinx |
| ECAD Module |
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| Mfr. Part Number | XC3S2000-4FGG900I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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XC3S2000-4FGG900I Specifications
| Manufacturer | Xilinx Inc. |
| Series | Spartan®-3 |
| Number of LABs/CLBs | 5120 |
| Number of Logic Elements/Cells | 46080 |
| Total RAM Bits | 737280 |
| Number of I/O | 565 |
| Number of Gates | 2000000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA |
| Supplier Device Package | 900-FBGA (31x31) |
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Manufacturer Xilinx Inc. Series Virtex® UltraScale™ Number of LABs/CLBs 115800 Number of Logic Elements/Cells 2026500 Total RAM Bits 130969600 Number of I/O 702 Number of Gates - Voltage - Supply 0.922V ~ 1.030V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 2104-BBGA, FCBGA Supplier Device Package 2104-FCBGA (47.5x47.5) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 276480 Number of I/O 223 Number of Gates 1500000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
