XC3S2000-4FGG900I
For Reference Only
| Part Number | XC3S2000-4FGG900I |
| PNEDA Part # | XC3S2000-4FGG900I |
| Description | IC FPGA 565 I/O 900FBGA |
| Manufacturer | Xilinx |
| Unit Price | Request a Quote |
| In Stock | 6,192 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 13 - Jun 18 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
|
Free shipping on orders over $100. PNEDA is willing to provide you with better services.
|
|
|
|
|
XC3S2000-4FGG900I Resources
| Brand | Xilinx |
| ECAD Module |
|
| Mfr. Part Number | XC3S2000-4FGG900I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
Payment Method
- Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
- If you need the detailed invoice or tax ID,please email us.
- Some orders may require a minimum amount of $100.00.
- Cheque or cash on delivery, processing may take an additional 3-5 days.
Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
- Tracking number will be sent once your order has been shipped.
- It may take up to 24 hours before carriers display the info.
Notes
- Please confirm the specifications of the products when ordering.
- If you have special order instructions,please note it on the ordering pages.
- Registered users can log in to the account to view the order status.
- You can email us to change the order details before shipment.
- Orders cannot be canceled after shipping the packages.
At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.
Our approach is built around proving our clients with three key advantages:
Prompt Responsiveness
Our team responds quickly to your requests, and gets to work immediately to find your parts.
Guaranteed Quality
Our quality-control processes guard against counterfeits while ensuring reliability and performance.
Global Access
Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.
Hot search vocabulary
- XC3S2000-4FGG900I Datasheet
- where to find XC3S2000-4FGG900I
- Xilinx
- Xilinx XC3S2000-4FGG900I
- XC3S2000-4FGG900I PDF Datasheet
- XC3S2000-4FGG900I Stock
- XC3S2000-4FGG900I Pinout
- Datasheet XC3S2000-4FGG900I
- XC3S2000-4FGG900I Supplier
- Xilinx Distributor
- XC3S2000-4FGG900I Price
- XC3S2000-4FGG900I Distributor
XC3S2000-4FGG900I Specifications
| Manufacturer | Xilinx Inc. |
| Series | Spartan®-3 |
| Number of LABs/CLBs | 5120 |
| Number of Logic Elements/Cells | 46080 |
| Total RAM Bits | 737280 |
| Number of I/O | 565 |
| Number of Gates | 2000000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA |
| Supplier Device Package | 900-FBGA (31x31) |
The Products You May Be Interested In
|
Manufacturer Xilinx Inc. Series Virtex® UltraScale™ Number of LABs/CLBs 115800 Number of Logic Elements/Cells 2026500 Total RAM Bits 130969600 Number of I/O 702 Number of Gates - Voltage - Supply 0.922V ~ 1.030V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 2104-BBGA, FCBGA Supplier Device Package 2104-FCBGA (47.5x47.5) |
Manufacturer Intel Series MAX® 10 Number of LABs/CLBs 2500 Number of Logic Elements/Cells 40000 Total RAM Bits 1290240 Number of I/O 178 Number of Gates - Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FBGA (17x17) |
Manufacturer Xilinx Inc. Series Spartan®-XL Number of LABs/CLBs 100 Number of Logic Elements/Cells 238 Total RAM Bits 3200 Number of I/O 77 Number of Gates 5000 Voltage - Supply 3V ~ 3.6V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 100-TQFP Supplier Device Package 100-VQFP (14x14) |
Manufacturer Lattice Semiconductor Corporation Series ECP2M Number of LABs/CLBs 6000 Number of Logic Elements/Cells 48000 Total RAM Bits 4246528 Number of I/O 410 Number of Gates - Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 900-BBGA Supplier Device Package 900-FPBGA (31x31) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 110592 Number of I/O 172 Number of Gates 600000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 85°C (TA) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) |
