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XC7Z030-2FBG676I

XC7Z030-2FBG676I

For Reference Only

Part Number XC7Z030-2FBG676I
PNEDA Part # XC7Z030-2FBG676I
Description IC SOC CORTEX-A9 800MHZ 676FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 153
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 18 - Jun 23 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XC7Z030-2FBG676I Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXC7Z030-2FBG676I
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XC7Z030-2FBG676I, XC7Z030-2FBG676I Datasheet (Total Pages: 25, Size: 716.41 KB)
PDFXC7Z045-2FBG676CES Datasheet Cover
XC7Z045-2FBG676CES Datasheet Page 2 XC7Z045-2FBG676CES Datasheet Page 3 XC7Z045-2FBG676CES Datasheet Page 4 XC7Z045-2FBG676CES Datasheet Page 5 XC7Z045-2FBG676CES Datasheet Page 6 XC7Z045-2FBG676CES Datasheet Page 7 XC7Z045-2FBG676CES Datasheet Page 8 XC7Z045-2FBG676CES Datasheet Page 9 XC7Z045-2FBG676CES Datasheet Page 10 XC7Z045-2FBG676CES Datasheet Page 11

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XC7Z030-2FBG676I Specifications

ManufacturerXilinx Inc.
SeriesZynq®-7000
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)

The Products You May Be Interested In

Manufacturer

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Series

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Architecture

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Core Processor

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Flash Size

-

RAM Size

256KB

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

667MHz

Primary Attributes

Kintex™-7 FPGA, 125K Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

676-BBGA, FCBGA

Supplier Device Package

676-FCBGA (27x27)

Manufacturer

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Series

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Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

Flash Size

-

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Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

625-BFBGA, FCBGA

Supplier Device Package

625-FCBGA (21x21)

M2S150-FCG1152I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

512KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

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CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

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Primary Attributes

FPGA - 150K Logic Modules

Operating Temperature

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Package / Case

1152-BBGA, FCBGA

Supplier Device Package

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M2S025TS-FCS325I

Microsemi

Manufacturer

Microsemi Corporation

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Architecture

MCU, FPGA

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Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 25K Logic Modules

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

325-TFBGA, CSPBGA

Supplier Device Package

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Microsemi

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Peripherals

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CANbus, Ethernet, I²C, SPI, UART/USART, USB

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-40°C ~ 100°C (TJ)

Package / Case

484-BGA

Supplier Device Package

484-FPBGA (23x23)

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