Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

XCZU17EG-2FFVC1760E

XCZU17EG-2FFVC1760E

For Reference Only

Part Number XCZU17EG-2FFVC1760E
PNEDA Part # XCZU17EG-2FFVC1760E
Description IC SOC CORTEX-A53 1760FCBGA
Manufacturer Xilinx
Unit Price
1 ---------- $96,275.8097
50 ---------- $91,762.8811
100 ---------- $87,249.9525
200 ---------- $82,737.0239
400 ---------- $78,976.2501
500 ---------- $75,215.4763
In Stock 7,115
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 2 - May 7 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XCZU17EG-2FFVC1760E Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXCZU17EG-2FFVC1760E
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XCZU17EG-2FFVC1760E, XCZU17EG-2FFVC1760E Datasheet (Total Pages: 102, Size: 2,181.63 KB)
PDFXCZU19EG-3FFVD1760E Datasheet Cover
XCZU19EG-3FFVD1760E Datasheet Page 2 XCZU19EG-3FFVD1760E Datasheet Page 3 XCZU19EG-3FFVD1760E Datasheet Page 4 XCZU19EG-3FFVD1760E Datasheet Page 5 XCZU19EG-3FFVD1760E Datasheet Page 6 XCZU19EG-3FFVD1760E Datasheet Page 7 XCZU19EG-3FFVD1760E Datasheet Page 8 XCZU19EG-3FFVD1760E Datasheet Page 9 XCZU19EG-3FFVD1760E Datasheet Page 10 XCZU19EG-3FFVD1760E Datasheet Page 11

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • XCZU17EG-2FFVC1760E Datasheet
  • where to find XCZU17EG-2FFVC1760E
  • Xilinx

  • Xilinx XCZU17EG-2FFVC1760E
  • XCZU17EG-2FFVC1760E PDF Datasheet
  • XCZU17EG-2FFVC1760E Stock

  • XCZU17EG-2FFVC1760E Pinout
  • Datasheet XCZU17EG-2FFVC1760E
  • XCZU17EG-2FFVC1760E Supplier

  • Xilinx Distributor
  • XCZU17EG-2FFVC1760E Price
  • XCZU17EG-2FFVC1760E Distributor

XCZU17EG-2FFVC1760E Specifications

ManufacturerXilinx Inc.
SeriesZynq® UltraScale+™ MPSoC EG
ArchitectureMCU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed533MHz, 600MHz, 1.3GHz
Primary AttributesZynq®UltraScale+™ FPGA, 926K+ Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Package / Case1760-BBGA, FCBGA
Supplier Device Package1760-FCBGA (42.5x42.5)

The Products You May Be Interested In

A2F060M3E-1FGG256I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

128KB

RAM Size

16KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, I²C, SPI, UART/USART

Speed

100MHz

Primary Attributes

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

256-LBGA

Supplier Device Package

256-FPBGA (17x17)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

533MHz, 600MHz, 1.3GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1156-BBGA, FCBGA

Supplier Device Package

1156-FCBGA (35x35)

M2S090T-FGG676I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

512KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 90K Logic Modules

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

676-BGA

Supplier Device Package

676-FBGA (27x27)

M2S090T-1FGG484I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

512KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 90K Logic Modules

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

484-BGA

Supplier Device Package

484-FPBGA (23x23)

Manufacturer

Xilinx Inc.

Series

Automotive, AEC-Q100, Zynq®-7000 XA

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

667MHz

Primary Attributes

Artix™-7 FPGA, 85K Logic Cells

Operating Temperature

-40°C ~ 125°C (TJ)

Package / Case

484-LFBGA, CSPBGA

Supplier Device Package

484-CSPBGA (19x19)

Recently Sold

C8051F120-GQR

C8051F120-GQR

Silicon Labs

IC MCU 8BIT 128KB FLASH 100TQFP

LTM4644EY#PBF

LTM4644EY#PBF

Linear Technology/Analog Devices

DC DC CONVERTER 4X0.6-5.5V

A6B595KLWTR-T

A6B595KLWTR-T

Allegro MicroSystems, LLC

IC PWR DRVR 8BIT ADDRESS 20SOIC

SSM3J328R,LF

SSM3J328R,LF

Toshiba Semiconductor and Storage

MOSFET P-CH 20V 6A SOT23F

AT24C256C-SSHL-B

AT24C256C-SSHL-B

Microchip Technology

IC EEPROM 256K I2C 1MHZ 8SOIC

GSOT05C-E3-08

GSOT05C-E3-08

Vishay Semiconductor Diodes Division

TVS DIODE 5V 16V SOT23-3

FA-20H 16.0000MF10Z-AJ0

FA-20H 16.0000MF10Z-AJ0

EPSON

CRYSTAL 16.0000MHZ 8PF SMD

MPXM2010GS

MPXM2010GS

NXP

SENS PRESSURE 1.45 PSI MAX MPAK

IHLP2525CZER220M5A

IHLP2525CZER220M5A

Vishay Dale

FIXED IND 22UH 2.8A 174 MOHM SMD

RJH60D5BDPQ-E0#T2

RJH60D5BDPQ-E0#T2

Renesas Electronics America

IGBT 600V 75A 200W TO-247

PIC18F65J15-I/PT

PIC18F65J15-I/PT

Microchip Technology

IC MCU 8BIT 48KB FLASH 64TQFP

FMMT625TA

FMMT625TA

Diodes Incorporated

TRANS NPN 150V 1A SOT23-3