Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

XCZU17EG-2FFVD1760I

XCZU17EG-2FFVD1760I

For Reference Only

Part Number XCZU17EG-2FFVD1760I
PNEDA Part # XCZU17EG-2FFVD1760I
Description IC SOC CORTEX-A53 1760FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 3,906
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 2 - May 7 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XCZU17EG-2FFVD1760I Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXCZU17EG-2FFVD1760I
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XCZU17EG-2FFVD1760I, XCZU17EG-2FFVD1760I Datasheet (Total Pages: 102, Size: 2,181.63 KB)
PDFXCZU19EG-3FFVD1760E Datasheet Cover
XCZU19EG-3FFVD1760E Datasheet Page 2 XCZU19EG-3FFVD1760E Datasheet Page 3 XCZU19EG-3FFVD1760E Datasheet Page 4 XCZU19EG-3FFVD1760E Datasheet Page 5 XCZU19EG-3FFVD1760E Datasheet Page 6 XCZU19EG-3FFVD1760E Datasheet Page 7 XCZU19EG-3FFVD1760E Datasheet Page 8 XCZU19EG-3FFVD1760E Datasheet Page 9 XCZU19EG-3FFVD1760E Datasheet Page 10 XCZU19EG-3FFVD1760E Datasheet Page 11

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • XCZU17EG-2FFVD1760I Datasheet
  • where to find XCZU17EG-2FFVD1760I
  • Xilinx

  • Xilinx XCZU17EG-2FFVD1760I
  • XCZU17EG-2FFVD1760I PDF Datasheet
  • XCZU17EG-2FFVD1760I Stock

  • XCZU17EG-2FFVD1760I Pinout
  • Datasheet XCZU17EG-2FFVD1760I
  • XCZU17EG-2FFVD1760I Supplier

  • Xilinx Distributor
  • XCZU17EG-2FFVD1760I Price
  • XCZU17EG-2FFVD1760I Distributor

XCZU17EG-2FFVD1760I Specifications

ManufacturerXilinx Inc.
SeriesZynq® UltraScale+™ MPSoC EG
ArchitectureMCU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed533MHz, 600MHz, 1.3GHz
Primary AttributesZynq®UltraScale+™ FPGA, 926K+ Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1760-BBGA, FCBGA
Supplier Device Package1760-FCBGA (42.5x42.5)

The Products You May Be Interested In

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EV

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

533MHz, 600MHz, 1.3GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

Manufacturer

Xilinx Inc.

Series

Zynq®-7000

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

800MHz

Primary Attributes

Kintex™-7 FPGA, 444K Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1156-BBGA, FCBGA

Supplier Device Package

1156-FCBGA (35x35)

Manufacturer

Intel

Series

Arria 10 SX

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

1.5GHz

Primary Attributes

FPGA - 270K Logic Elements

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

780-BBGA, FCBGA

Supplier Device Package

780-FBGA, FC (29x29)

M2S050T-1FCSG325I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

256KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 50K Logic Modules

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

325-TFBGA, CSPBGA

Supplier Device Package

325-CSPBGA (11x11)

A2F500M3G-1PQG208I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

512KB

RAM Size

64KB

Peripherals

DMA, POR, WDT

Connectivity

Ethernet, I²C, SPI, UART/USART

Speed

100MHz

Primary Attributes

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

208-BFQFP

Supplier Device Package

208-PQFP (28x28)

Recently Sold

IRF7470PBF

IRF7470PBF

Infineon Technologies

MOSFET N-CH 40V 10A 8-SOIC

PC28F00BM29EWHA

PC28F00BM29EWHA

Micron Technology Inc.

IC FLASH 2G PARALLEL 64FBGA

M29W800DT70N6E

M29W800DT70N6E

Micron Technology Inc.

IC FLASH 8M PARALLEL 48TSOP

LPC2388FBD144,551

LPC2388FBD144,551

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

LT1308BIS8#TRPBF

LT1308BIS8#TRPBF

Linear Technology/Analog Devices

IC REG BST SEPIC ADJ 2A 8SOIC

ADT7411ARQZ-REEL

ADT7411ARQZ-REEL

Analog Devices

SENSOR DIGITAL -40C-120C 16QSOP

RJH60D5BDPQ-E0#T2

RJH60D5BDPQ-E0#T2

Renesas Electronics America

IGBT 600V 75A 200W TO-247

IRF9Z24NPBF

IRF9Z24NPBF

Infineon Technologies

MOSFET P-CH 55V 12A TO-220AB

LTM4644EY#PBF

LTM4644EY#PBF

Linear Technology/Analog Devices

DC DC CONVERTER 4X0.6-5.5V

AT45DB161D-SU

AT45DB161D-SU

Adesto Technologies

IC FLASH 16M SPI 66MHZ 8SOIC

ADM3310EACPZ

ADM3310EACPZ

Analog Devices

IC TRANSCEIVER FULL 3/5 32LFCSP

SSM2305RMZ-R2

SSM2305RMZ-R2

Analog Devices

IC AMP AUDIO 2.8W MONO D 8MSOP