XCZU19EG-1FFVB1517I
For Reference Only
| Part Number | XCZU19EG-1FFVB1517I |
| PNEDA Part # | XCZU19EG-1FFVB1517I |
| Description | IC SOC CORTEX-A53 1517FCBGA |
| Manufacturer | Xilinx |
| Unit Price | Request a Quote |
| In Stock | 5,922 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 22 - May 27 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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XCZU19EG-1FFVB1517I Resources
| Brand | Xilinx |
| ECAD Module |
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| Mfr. Part Number | XCZU19EG-1FFVB1517I |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Datasheet |
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XCZU19EG-1FFVB1517I Specifications
| Manufacturer | Xilinx Inc. |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
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Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 500MHz, 600MHz, 1.2GHz Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-FCBGA (42.5x42.5) |
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Manufacturer Intel Series Stratix® 10 SX Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 1.5GHz Primary Attributes FPGA - 2500K Logic Elements Operating Temperature 0°C ~ 100°C (TJ) Package / Case 2912-BBGA, FCBGA Supplier Device Package 2912-FBGA, FC (55x55) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 533MHz, 600MHz, 1.3GHz Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells Operating Temperature -40°C ~ 100°C (TJ) Package / Case 1760-BBGA, FCBGA Supplier Device Package 1760-FCBGA (42.5x42.5) |
