Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

XCZU2CG-2SFVA625E

XCZU2CG-2SFVA625E

For Reference Only

Part Number XCZU2CG-2SFVA625E
PNEDA Part # XCZU2CG-2SFVA625E
Description IC SOC CORTEX-A53 625FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 7,686
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 12 - May 17 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XCZU2CG-2SFVA625E Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXCZU2CG-2SFVA625E
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XCZU2CG-2SFVA625E, XCZU2CG-2SFVA625E Datasheet (Total Pages: 102, Size: 2,181.63 KB)
PDFXCZU19EG-3FFVD1760E Datasheet Cover
XCZU19EG-3FFVD1760E Datasheet Page 2 XCZU19EG-3FFVD1760E Datasheet Page 3 XCZU19EG-3FFVD1760E Datasheet Page 4 XCZU19EG-3FFVD1760E Datasheet Page 5 XCZU19EG-3FFVD1760E Datasheet Page 6 XCZU19EG-3FFVD1760E Datasheet Page 7 XCZU19EG-3FFVD1760E Datasheet Page 8 XCZU19EG-3FFVD1760E Datasheet Page 9 XCZU19EG-3FFVD1760E Datasheet Page 10 XCZU19EG-3FFVD1760E Datasheet Page 11

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • XCZU2CG-2SFVA625E Datasheet
  • where to find XCZU2CG-2SFVA625E
  • Xilinx

  • Xilinx XCZU2CG-2SFVA625E
  • XCZU2CG-2SFVA625E PDF Datasheet
  • XCZU2CG-2SFVA625E Stock

  • XCZU2CG-2SFVA625E Pinout
  • Datasheet XCZU2CG-2SFVA625E
  • XCZU2CG-2SFVA625E Supplier

  • Xilinx Distributor
  • XCZU2CG-2SFVA625E Price
  • XCZU2CG-2SFVA625E Distributor

XCZU2CG-2SFVA625E Specifications

ManufacturerXilinx Inc.
SeriesZynq® UltraScale+™ MPSoC CG
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed533MHz, 1.3GHz
Primary AttributesZynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Package / Case625-BFBGA, FCBGA
Supplier Device Package625-FCBGA (21x21)

The Products You May Be Interested In

M2S060T-FGG676

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

256KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 60K Logic Modules

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

676-BGA

Supplier Device Package

676-FBGA (27x27)

M2S050-FG896I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

256KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 50K Logic Modules

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

896-BGA

Supplier Device Package

896-FBGA (31x31)

Manufacturer

Intel

Series

Arria 10 SX

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

1.5GHz

Primary Attributes

FPGA - 480K Logic Elements

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

1152-BBGA, FCBGA

Supplier Device Package

1152-FBGA, FC (35x35)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EV

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

600MHz, 1.5GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

1156-BBGA, FCBGA

Supplier Device Package

1156-FCBGA (35x35)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC CG

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

533MHz, 1.3GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

625-BFBGA, FCBGA

Supplier Device Package

625-FCBGA (21x21)

Recently Sold

ADV7125WBSTZ170

ADV7125WBSTZ170

Analog Devices

IC DAC 8BIT A-OUT 48LQFP

BC560CTA

BC560CTA

ON Semiconductor

TRANS PNP 45V 0.1A TO-92

FDS4435BZ

FDS4435BZ

ON Semiconductor

MOSFET P-CH 30V 8.8A 8-SOIC

EXB-38V102JV

EXB-38V102JV

Panasonic Electronic Components

RES ARRAY 4 RES 1K OHM 1206

IRF9321TRPBF

IRF9321TRPBF

Infineon Technologies

MOSFET P-CH 30V 15A 8-SOIC

PI3VDP411LSRZBE

PI3VDP411LSRZBE

Diodes Incorporated

IC DEMULTIPLEXER 48TQFN

AD694ARZ-REEL

AD694ARZ-REEL

Analog Devices

IC TRANSMITTER 4-20MA 16-SOIC

FBMH1608HM600-T

FBMH1608HM600-T

Taiyo Yuden

FERRITE BEAD 60 OHM 0603 1LN

M24256-BRMN6TP

M24256-BRMN6TP

STMicroelectronics

IC EEPROM 256K I2C 1MHZ 8SO

PS21A79

PS21A79

Powerex Inc.

MOD IPM 600V 50A LARGE DIP

ADM1021ARQ

ADM1021ARQ

ON Semiconductor

IC SENSOR TEMP DUAL3/5.5V 16QSOP

ADP2107ACPZ-1.2-R7

ADP2107ACPZ-1.2-R7

Analog Devices

IC REG BUCK 1.2V 2A 16LFCSP