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XCZU3CG-L1SBVA484I

XCZU3CG-L1SBVA484I

For Reference Only

Part Number XCZU3CG-L1SBVA484I
PNEDA Part # XCZU3CG-L1SBVA484I
Description IC SOC CORTEX-A53 484FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 6,066
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 18 - Jun 23 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XCZU3CG-L1SBVA484I Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXCZU3CG-L1SBVA484I
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XCZU3CG-L1SBVA484I, XCZU3CG-L1SBVA484I Datasheet (Total Pages: 102, Size: 2,181.63 KB)
PDFXCZU19EG-3FFVD1760E Datasheet Cover
XCZU19EG-3FFVD1760E Datasheet Page 2 XCZU19EG-3FFVD1760E Datasheet Page 3 XCZU19EG-3FFVD1760E Datasheet Page 4 XCZU19EG-3FFVD1760E Datasheet Page 5 XCZU19EG-3FFVD1760E Datasheet Page 6 XCZU19EG-3FFVD1760E Datasheet Page 7 XCZU19EG-3FFVD1760E Datasheet Page 8 XCZU19EG-3FFVD1760E Datasheet Page 9 XCZU19EG-3FFVD1760E Datasheet Page 10 XCZU19EG-3FFVD1760E Datasheet Page 11

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XCZU3CG-L1SBVA484I Specifications

ManufacturerXilinx Inc.
SeriesZynq® UltraScale+™ MPSoC CG
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed500MHz, 1.2GHz
Primary AttributesZynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case484-BFBGA, FCBGA
Supplier Device Package484-FCBGA (19x19)

The Products You May Be Interested In

Manufacturer

Xilinx Inc.

Series

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Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

533MHz, 1.3GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

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Microsemi

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Series

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Core Processor

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Flash Size

256KB

RAM Size

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Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 25K Logic Modules

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

325-TFBGA, CSPBGA

Supplier Device Package

325-CSPBGA (11x11)

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Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

256KB

RAM Size

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Peripherals

DDR, PCIe, SERDES

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Speed

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Primary Attributes

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Operating Temperature

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Package / Case

400-LFBGA

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400-VFBGA (17x17)

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Microsemi

Manufacturer

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Series

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Flash Size

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Speed

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Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

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Architecture

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-

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