Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

XCZU3EG-1SFVA625E

XCZU3EG-1SFVA625E

For Reference Only

Part Number XCZU3EG-1SFVA625E
PNEDA Part # XCZU3EG-1SFVA625E
Description IC SOC CORTEX-A53 625FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 2,682
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 19 - May 24 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XCZU3EG-1SFVA625E Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXCZU3EG-1SFVA625E
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XCZU3EG-1SFVA625E, XCZU3EG-1SFVA625E Datasheet (Total Pages: 42, Size: 1,058.56 KB)
PDFXCZU3EG-3SFVC784E Datasheet Cover
XCZU3EG-3SFVC784E Datasheet Page 2 XCZU3EG-3SFVC784E Datasheet Page 3 XCZU3EG-3SFVC784E Datasheet Page 4 XCZU3EG-3SFVC784E Datasheet Page 5 XCZU3EG-3SFVC784E Datasheet Page 6 XCZU3EG-3SFVC784E Datasheet Page 7 XCZU3EG-3SFVC784E Datasheet Page 8 XCZU3EG-3SFVC784E Datasheet Page 9 XCZU3EG-3SFVC784E Datasheet Page 10 XCZU3EG-3SFVC784E Datasheet Page 11

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • XCZU3EG-1SFVA625E Datasheet
  • where to find XCZU3EG-1SFVA625E
  • Xilinx

  • Xilinx XCZU3EG-1SFVA625E
  • XCZU3EG-1SFVA625E PDF Datasheet
  • XCZU3EG-1SFVA625E Stock

  • XCZU3EG-1SFVA625E Pinout
  • Datasheet XCZU3EG-1SFVA625E
  • XCZU3EG-1SFVA625E Supplier

  • Xilinx Distributor
  • XCZU3EG-1SFVA625E Price
  • XCZU3EG-1SFVA625E Distributor

XCZU3EG-1SFVA625E Specifications

ManufacturerXilinx Inc.
SeriesZynq® UltraScale+™ MPSoC EG
ArchitectureMCU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed500MHz, 600MHz, 1.2GHz
Primary AttributesZynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Package / Case625-BFBGA, FCBGA
Supplier Device Package625-FCBGA (21x21)

The Products You May Be Interested In

M2S100T-1FC1152

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

512KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 100K Logic Modules

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

1152-BBGA, FCBGA

Supplier Device Package

1152-FCBGA (35x35)

M2S010T-1VF400

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

256KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 10K Logic Modules

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

400-LFBGA

Supplier Device Package

400-VFBGA (17x17)

A2F060M3E-TQG144I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

128KB

RAM Size

16KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, I²C, SPI, UART/USART

Speed

80MHz

Primary Attributes

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

144-LQFP

Supplier Device Package

144-TQFP (20x20)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 600MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

1924-BBGA, FCBGA

Supplier Device Package

1924-FCBGA (45x45)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 600MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1517-BBGA, FCBGA

Supplier Device Package

1517-FCBGA (40x40)

Recently Sold

NE3509M04-A

NE3509M04-A

CEL

FET RF 4V 2GHZ 4-SMINI

MCP23017-E/SO

MCP23017-E/SO

Microchip Technology

IC I/O EXPANDER I2C 16B 28SOIC

T491C107K016AT

T491C107K016AT

KEMET

CAP TANT 100UF 10% 16V 2312

REF195GS

REF195GS

Analog Devices

IC VREF SERIES 5V 8SOIC

TAJA226K010RNJ

TAJA226K010RNJ

CAP TANT 22UF 10% 10V 1206

3214W-1-502E

3214W-1-502E

Bourns

TRIMMER 5K OHM 0.25W J LEAD TOP

SMCJ24A-13-F

SMCJ24A-13-F

Diodes Incorporated

TVS DIODE 24V 38.9V SMC

STBB1-APUR

STBB1-APUR

STMicroelectronics

IC REG BCK BST ADJ 1.6A 10DFN

0451015.MRL

0451015.MRL

Littelfuse

FUSE BRD MNT 15A 65VAC/VDC 2SMD

MMSZ4700T1G

MMSZ4700T1G

ON Semiconductor

DIODE ZENER 13V 500MW SOD123

MAX3078EESA+T

MAX3078EESA+T

Maxim Integrated

IC TRANSCEIVER HALF 1/1 8SOIC

MD918A

MD918A

Central Semiconductor Corp

TRANS 2NPN 50MA 15V TO78-6