XCZU9EG-3FFVC900E
For Reference Only
| Part Number | XCZU9EG-3FFVC900E |
| PNEDA Part # | XCZU9EG-3FFVC900E |
| Description | IC SOC CORTEX-A53 900FCBGA |
| Manufacturer | Xilinx |
| Unit Price | Request a Quote |
| In Stock | 4,788 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 19 - May 24 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
|
Free shipping on orders over $100. PNEDA is willing to provide you with better services.
|
|
|
|
|
XCZU9EG-3FFVC900E Resources
| Brand | Xilinx |
| ECAD Module |
|
| Mfr. Part Number | XCZU9EG-3FFVC900E |
| Category | Semiconductors › Embedded Processors & Controllers › SoC (System On Chip) |
| Datasheet |
Payment Method
- Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
- If you need the detailed invoice or tax ID,please email us.
- Some orders may require a minimum amount of $100.00.
- Cheque or cash on delivery, processing may take an additional 3-5 days.
Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
- Tracking number will be sent once your order has been shipped.
- It may take up to 24 hours before carriers display the info.
Notes
- Please confirm the specifications of the products when ordering.
- If you have special order instructions,please note it on the ordering pages.
- Registered users can log in to the account to view the order status.
- You can email us to change the order details before shipment.
- Orders cannot be canceled after shipping the packages.
At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.
Our approach is built around proving our clients with three key advantages:
Prompt Responsiveness
Our team responds quickly to your requests, and gets to work immediately to find your parts.
Guaranteed Quality
Our quality-control processes guard against counterfeits while ensuring reliability and performance.
Global Access
Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.
Hot search vocabulary
- XCZU9EG-3FFVC900E Datasheet
- where to find XCZU9EG-3FFVC900E
- Xilinx
- Xilinx XCZU9EG-3FFVC900E
- XCZU9EG-3FFVC900E PDF Datasheet
- XCZU9EG-3FFVC900E Stock
- XCZU9EG-3FFVC900E Pinout
- Datasheet XCZU9EG-3FFVC900E
- XCZU9EG-3FFVC900E Supplier
- Xilinx Distributor
- XCZU9EG-3FFVC900E Price
- XCZU9EG-3FFVC900E Distributor
XCZU9EG-3FFVC900E Specifications
| Manufacturer | Xilinx Inc. |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.5GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
The Products You May Be Interested In
|
Manufacturer Intel Series Arria V SX Architecture MCU, FPGA Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size - RAM Size 64KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 925MHz Primary Attributes FPGA - 462K Logic Elements Operating Temperature 0°C ~ 85°C (TJ) Package / Case 896-BBGA, FCBGA Supplier Device Package 896-FBGA, FC (31x31) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 256KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 25K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 400-LFBGA Supplier Device Package 400-VFBGA (17x17) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 512KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 90K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package 676-FBGA (27x27) |
Manufacturer Microsemi Corporation Series SmartFusion®2 Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 512KB RAM Size 64KB Peripherals DDR, PCIe, SERDES Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed 166MHz Primary Attributes FPGA - 90K Logic Modules Operating Temperature -40°C ~ 100°C (TJ) Package / Case 325-TFBGA, CSPBGA Supplier Device Package 325-CSPBGA (11x11) |
