Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

XCZU9EG-L1FFVB1156I

XCZU9EG-L1FFVB1156I

For Reference Only

Part Number XCZU9EG-L1FFVB1156I
PNEDA Part # XCZU9EG-L1FFVB1156I
Description IC SOC CORTEX-A53 1156FCBGA
Manufacturer Xilinx
Unit Price Request a Quote
In Stock 2,916
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 3 - May 8 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XCZU9EG-L1FFVB1156I Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXCZU9EG-L1FFVB1156I
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XCZU9EG-L1FFVB1156I, XCZU9EG-L1FFVB1156I Datasheet (Total Pages: 42, Size: 1,058.56 KB)
PDFXCZU3EG-3SFVC784E Datasheet Cover
XCZU3EG-3SFVC784E Datasheet Page 2 XCZU3EG-3SFVC784E Datasheet Page 3 XCZU3EG-3SFVC784E Datasheet Page 4 XCZU3EG-3SFVC784E Datasheet Page 5 XCZU3EG-3SFVC784E Datasheet Page 6 XCZU3EG-3SFVC784E Datasheet Page 7 XCZU3EG-3SFVC784E Datasheet Page 8 XCZU3EG-3SFVC784E Datasheet Page 9 XCZU3EG-3SFVC784E Datasheet Page 10 XCZU3EG-3SFVC784E Datasheet Page 11

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • XCZU9EG-L1FFVB1156I Datasheet
  • where to find XCZU9EG-L1FFVB1156I
  • Xilinx

  • Xilinx XCZU9EG-L1FFVB1156I
  • XCZU9EG-L1FFVB1156I PDF Datasheet
  • XCZU9EG-L1FFVB1156I Stock

  • XCZU9EG-L1FFVB1156I Pinout
  • Datasheet XCZU9EG-L1FFVB1156I
  • XCZU9EG-L1FFVB1156I Supplier

  • Xilinx Distributor
  • XCZU9EG-L1FFVB1156I Price
  • XCZU9EG-L1FFVB1156I Distributor

XCZU9EG-L1FFVB1156I Specifications

ManufacturerXilinx Inc.
SeriesZynq® UltraScale+™ MPSoC EG
ArchitectureMCU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed500MHz, 600MHz, 1.2GHz
Primary AttributesZynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1156-BBGA, FCBGA
Supplier Device Package1156-FCBGA (35x35)

The Products You May Be Interested In

M2S150T-1FCG1152I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

512KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 150K Logic Modules

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1152-BBGA, FCBGA

Supplier Device Package

1152-FCBGA (35x35)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC CG

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

600MHz, 667MHz, 1.5GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

500MHz, 600MHz, 1.2GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

625-BFBGA, FCBGA

Supplier Device Package

625-FCBGA (21x21)

M2S010T-1VFG256I

Microsemi

Manufacturer

Microsemi Corporation

Series

SmartFusion®2

Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

256KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 10K Logic Modules

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

256-LBGA

Supplier Device Package

256-FPBGA (17x17)

Recently Sold

VMMK-1218-TR1G

VMMK-1218-TR1G

Broadcom

FET RF 5V 10GHZ 0402

ATMEGA16-16AC

ATMEGA16-16AC

Microchip Technology

IC MCU 8BIT 16KB FLASH 44TQFP

50ZL560MEFC12.5X25

50ZL560MEFC12.5X25

Rubycon

CAP ALUM 560UF 20% 50V RADIAL

NFA31GD1014704D

NFA31GD1014704D

Murata

FILTER RC 47 OHM/100PF SMD

4TPE220MAZB

4TPE220MAZB

Panasonic Electronic Components

CAP TANT POLY 220UF 4V 1411

74HC74A

74HC74A

MICROSS/On Semiconductor

IC FF D-TYPE DUAL DIE

SSCMRRN100MGAF5

SSCMRRN100MGAF5

Honeywell Sensing and Productivity Solutions

SENSOR PRES .1BAR GAUG 5V SMD

SSM3J328R,LF

SSM3J328R,LF

Toshiba Semiconductor and Storage

MOSFET P-CH 20V 6A SOT23F

BAT54C

BAT54C

ON Semiconductor

DIODE ARRAY SCHOTTKY 30V SOT23-3

CY2305SXI-1HT

CY2305SXI-1HT

Cypress Semiconductor

IC CLK ZDB 5OUT 133MHZ 8SOIC

MCP6566UT-E/OT

MCP6566UT-E/OT

Microchip Technology

IC COMPARATOR O-D 1.8V SOT23-5

NCP81071BDR2G

NCP81071BDR2G

ON Semiconductor

IC MOSFET DVR HS 5A DUAL 8SOIC