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XPC823CZT66B2T

XPC823CZT66B2T

For Reference Only

Part Number XPC823CZT66B2T
PNEDA Part # XPC823CZT66B2T
Description IC MPU MPC8XX 66MHZ 256BGA
Manufacturer NXP
Unit Price Request a Quote
In Stock 5,346
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 20 - May 25 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XPC823CZT66B2T Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberXPC823CZT66B2T
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors
Datasheet
XPC823CZT66B2T, XPC823CZT66B2T Datasheet (Total Pages: 12, Size: 337.16 KB)
PDFMPC823CVR66B2T Datasheet Cover
MPC823CVR66B2T Datasheet Page 2 MPC823CVR66B2T Datasheet Page 3 MPC823CVR66B2T Datasheet Page 4 MPC823CVR66B2T Datasheet Page 5 MPC823CVR66B2T Datasheet Page 6 MPC823CVR66B2T Datasheet Page 7 MPC823CVR66B2T Datasheet Page 8 MPC823CVR66B2T Datasheet Page 9 MPC823CVR66B2T Datasheet Page 10 MPC823CVR66B2T Datasheet Page 11

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XPC823CZT66B2T Specifications

ManufacturerNXP USA Inc.
SeriesMPC8xx
Core ProcessorPowerPC
Number of Cores/Bus Width1 Core, 32-Bit
Speed66MHz
Co-Processors/DSPCommunications; RISC CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface ControllersLCD, Video
Ethernet10Mbps (1)
SATA-
USBUSB 1.x (1)
Voltage - I/O3.3V
Operating Temperature-40°C ~ 95°C (TA)
Security Features-
Package / Case256-BBGA
Supplier Device Package256-PBGA (23x23)

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Core Processor

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Number of Cores/Bus Width

1 Core, 32-Bit

Speed

266MHz

Co-Processors/DSP

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RAM Controllers

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Graphics Acceleration

No

Display & Interface Controllers

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Ethernet

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SATA

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USB

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Voltage - I/O

3.3V

Operating Temperature

-40°C ~ 110°C (TC)

Security Features

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Package / Case

255-BCBGA Exposed Pad

Supplier Device Package

255-CBGA (21x21)

Manufacturer

NXP USA Inc.

Series

MPC8xx

Core Processor

MPC8xx

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

50MHz

Co-Processors/DSP

Communications; CPM

RAM Controllers

DRAM

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10Mbps (1)

SATA

-

USB

USB 1.x (1)

Voltage - I/O

3.3V

Operating Temperature

0°C ~ 95°C (TA)

Security Features

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Package / Case

256-BBGA

Supplier Device Package

256-PBGA (23x23)

Manufacturer

NXP USA Inc.

Series

i.MX23

Core Processor

ARM926EJ-S

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

454MHz

Co-Processors/DSP

Data; DCP

RAM Controllers

DRAM

Graphics Acceleration

No

Display & Interface Controllers

LCD, Touchscreen

Ethernet

-

SATA

-

USB

USB 2.0 + PHY (1)

Voltage - I/O

2.0V, 2.5V, 2.7V, 3.0V, 3.3V

Operating Temperature

-40°C ~ 85°C (TA)

Security Features

Cryptography, Hardware ID

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169-LFBGA

Supplier Device Package

169-MAPBGA (11x11)

Manufacturer

NXP USA Inc.

Series

i.MX51

Core Processor

ARM® Cortex®-A8

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

600MHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR, DDR2

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100Mbps (1)

SATA

-

USB

USB 2.0 (3), USB 2.0 + PHY (1)

Voltage - I/O

1.2V, 1.875V, 2.775V, 3.0V

Operating Temperature

-40°C ~ 125°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC

Package / Case

529-LFBGA

Supplier Device Package

529-BGA (19x19)

Manufacturer

NXP USA Inc.

Series

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Core Processor

ARM® Cortex®-A72

Number of Cores/Bus Width

4 Core, 64-Bit

Speed

1.8GHz

Co-Processors/DSP

-

RAM Controllers

DDR4

Graphics Acceleration

-

Display & Interface Controllers

-

Ethernet

10GbE (2), 2.5GbE (1), 1GbE (4)

SATA

SATA 6Gbps (1)

USB

USB 3.0 (3) + PHY

Voltage - I/O

-

Operating Temperature

0°C ~ 105°C

Security Features

Secure Boot, TrustZone®

Package / Case

780-FBGA, FCBGA

Supplier Device Package

780-FCPBGA (23x23)

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