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XPC850DSLZT50BU

XPC850DSLZT50BU

For Reference Only

Part Number XPC850DSLZT50BU
PNEDA Part # XPC850DSLZT50BU
Description IC MPU MPC8XX 50MHZ 256BGA
Manufacturer NXP
Unit Price Request a Quote
In Stock 2,574
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 11 - May 16 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XPC850DSLZT50BU Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberXPC850DSLZT50BU
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors
Datasheet
XPC850DSLZT50BU, XPC850DSLZT50BU Datasheet (Total Pages: 72, Size: 1,494.66 KB)
PDFKMPC850DSLVR50BU Datasheet Cover
KMPC850DSLVR50BU Datasheet Page 2 KMPC850DSLVR50BU Datasheet Page 3 KMPC850DSLVR50BU Datasheet Page 4 KMPC850DSLVR50BU Datasheet Page 5 KMPC850DSLVR50BU Datasheet Page 6 KMPC850DSLVR50BU Datasheet Page 7 KMPC850DSLVR50BU Datasheet Page 8 KMPC850DSLVR50BU Datasheet Page 9 KMPC850DSLVR50BU Datasheet Page 10 KMPC850DSLVR50BU Datasheet Page 11

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XPC850DSLZT50BU Specifications

ManufacturerNXP USA Inc.
SeriesMPC8xx
Core ProcessorMPC8xx
Number of Cores/Bus Width1 Core, 32-Bit
Speed50MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10Mbps (1)
SATA-
USBUSB 1.x (1)
Voltage - I/O3.3V
Operating Temperature0°C ~ 95°C (TA)
Security Features-
Package / Case256-BGA
Supplier Device Package256-PBGA (23x23)

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Security Features

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

Package / Case

624-FBGA, FCBGA

Supplier Device Package

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Manufacturer

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Series

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Core Processor

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Number of Cores/Bus Width

1 Core, 32-Bit

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Co-Processors/DSP

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Number of Cores/Bus Width

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Co-Processors/DSP

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Graphics Acceleration

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Core Processor

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Number of Cores/Bus Width

4 Core, 32-Bit

Speed

1.2GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD

Ethernet

10/100/1000Mbps (1)

SATA

SATA 3Gbps (1)

USB

USB 2.0 + PHY (4)

Voltage - I/O

1.8V, 2.5V, 2.8V, 3.3V

Operating Temperature

-20°C ~ 105°C (TJ)

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

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624-LFBGA, FCBGA

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624-FCPBGA (21x21)

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