Certifications

iso9001
iso14001
icas
Delivery
security
warranty
roiginal
RoHS
UL
Millions of Electronic Parts In Stock. Price & Lead Time Quotes within 24 Hours.

XPC850SRCVR66BU

XPC850SRCVR66BU

For Reference Only

Part Number XPC850SRCVR66BU
PNEDA Part # XPC850SRCVR66BU
Description IC MPU MPC8XX 66MHZ 256BGA
Manufacturer NXP
Unit Price Request a Quote
In Stock 3,744
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jun 18 - Jun 23 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XPC850SRCVR66BU Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberXPC850SRCVR66BU
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors
Datasheet
XPC850SRCVR66BU, XPC850SRCVR66BU Datasheet (Total Pages: 72, Size: 1,494.66 KB)
PDFKMPC850DSLVR50BU Datasheet Cover
KMPC850DSLVR50BU Datasheet Page 2 KMPC850DSLVR50BU Datasheet Page 3 KMPC850DSLVR50BU Datasheet Page 4 KMPC850DSLVR50BU Datasheet Page 5 KMPC850DSLVR50BU Datasheet Page 6 KMPC850DSLVR50BU Datasheet Page 7 KMPC850DSLVR50BU Datasheet Page 8 KMPC850DSLVR50BU Datasheet Page 9 KMPC850DSLVR50BU Datasheet Page 10 KMPC850DSLVR50BU Datasheet Page 11

Payment Method

TT Unionpay paypal paypalwtcreditcard alipay wu
  • Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
  • If you need the detailed invoice or tax ID,please email us.
  • Some orders may require a minimum amount of $100.00.
  • Cheque or cash on delivery, processing may take an additional 3-5 days.

Logistics Mode

TNT UPS Fedex EMS DHL
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped.
  • It may take up to 24 hours before carriers display the info.

Notes

  • Please confirm the specifications of the products when ordering.
  • If you have special order instructions,please note it on the ordering pages.
  • Registered users can log in to the account to view the order status.
  • You can email us to change the order details before shipment.
  • Orders cannot be canceled after shipping the packages.

At PNEDA, we strive to be the industry leader by quickly and reliably supplying high-quality electronic components to our clients.

Our approach is built around proving our clients with three key advantages:

  • Prompt Responsiveness

    Our team responds quickly to your requests, and gets to work immediately to find your parts.

  • Guaranteed Quality

    Our quality-control processes guard against counterfeits while ensuring reliability and performance.

  • Global Access

    Our worldwide network of trusted resources allows us to find and deliver the specific parts you need.

Hot search vocabulary

  • XPC850SRCVR66BU Datasheet
  • where to find XPC850SRCVR66BU
  • NXP

  • NXP XPC850SRCVR66BU
  • XPC850SRCVR66BU PDF Datasheet
  • XPC850SRCVR66BU Stock

  • XPC850SRCVR66BU Pinout
  • Datasheet XPC850SRCVR66BU
  • XPC850SRCVR66BU Supplier

  • NXP Distributor
  • XPC850SRCVR66BU Price
  • XPC850SRCVR66BU Distributor

XPC850SRCVR66BU Specifications

ManufacturerNXP USA Inc.
SeriesMPC8xx
Core ProcessorMPC8xx
Number of Cores/Bus Width1 Core, 32-Bit
Speed66MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10Mbps (1)
SATA-
USBUSB 1.x (1)
Voltage - I/O3.3V
Operating Temperature-40°C ~ 95°C (TA)
Security Features-
Package / Case256-BBGA
Supplier Device Package256-PBGA (23x23)

The Products You May Be Interested In

TSPC603RVGS10LC

Microchip Technology

Manufacturer

Microchip Technology

Series

-

Core Processor

PowerPC 603e

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

233MHz

Co-Processors/DSP

-

RAM Controllers

-

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

-

SATA

-

USB

-

Voltage - I/O

3.3V

Operating Temperature

-40°C ~ 110°C (TC)

Security Features

-

Package / Case

255-BCBGA Exposed Pad

Supplier Device Package

255-CI-CGA (21x21)

Manufacturer

NXP USA Inc.

Series

MPC82xx

Core Processor

PowerPC G2_LE

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

450MHz

Co-Processors/DSP

Communications; RISC CPM

RAM Controllers

DRAM, SDRAM

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10/100Mbps (3)

SATA

-

USB

USB 2.0 (1)

Voltage - I/O

3.3V

Operating Temperature

0°C ~ 105°C (TA)

Security Features

-

Package / Case

480-LBGA Exposed Pad

Supplier Device Package

480-TBGA (37.5x37.5)

Manufacturer

NXP USA Inc.

Series

MPC8xx

Core Processor

MPC8xx

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

133MHz

Co-Processors/DSP

Communications; CPM

RAM Controllers

DRAM

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10Mbps (2), 10/100Mbps (2)

SATA

-

USB

USB 2.0 (1)

Voltage - I/O

3.3V

Operating Temperature

-40°C ~ 100°C (TA)

Security Features

-

Package / Case

357-BBGA

Supplier Device Package

357-PBGA (25x25)

Manufacturer

NXP USA Inc.

Series

i.MX6DP

Core Processor

ARM® Cortex®-A9

Number of Cores/Bus Width

2 Core, 32-Bit

Speed

1.0GHz

Co-Processors/DSP

Multimedia; NEON™ SIMD

RAM Controllers

LPDDR2, DDR3L, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel

Ethernet

10/100/1000Mbps (1)

SATA

SATA 3Gbps (1)

USB

USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)

Voltage - I/O

1.8V, 2.5V, 2.8V, 3.3V

Operating Temperature

-20°C ~ 105°C (TJ)

Security Features

ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

Package / Case

624-LFBGA, FCBGA

Supplier Device Package

624-FCPBGA (21x21)

Manufacturer

NXP USA Inc.

Series

MPC83xx

Core Processor

PowerPC e300c3

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

267MHz

Co-Processors/DSP

Security; SEC 2.2

RAM Controllers

DDR, DDR2

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10/100/1000Mbps (2)

SATA

-

USB

USB 2.0 + PHY (1)

Voltage - I/O

1.8V, 2.5V, 3.3V

Operating Temperature

0°C ~ 105°C (TA)

Security Features

Cryptography

Package / Case

516-BBGA Exposed Pad

Supplier Device Package

516-TEPBGA (27x27)

Recently Sold

1526GLF

1526GLF

IDT, Integrated Device Technology

IC VIDEO CLK SYNTHESIZER 16TSSOP

06035C104KAT2A

06035C104KAT2A

CAP CER 0.1UF 50V X7R 0603

S29JL064J60TFI003

S29JL064J60TFI003

Cypress Semiconductor

IC FLASH 64M PARALLEL 48TSOP

PIC32MX250F128D-I/PT

PIC32MX250F128D-I/PT

Microchip Technology

IC MCU 32BIT 128KB FLASH 44TQFP

HSMG-C170

HSMG-C170

Broadcom

LED GREEN DIFFUSED CHIP SMD

SD103AW-E3-08

SD103AW-E3-08

Vishay Semiconductor Diodes Division

DIODE SCHOTTKY 40V SOD123

PIC18F2525-I/SO

PIC18F2525-I/SO

Microchip Technology

IC MCU 8BIT 48KB FLASH 28SOIC

2N3390

2N3390

ON Semiconductor

TRANS NPN 25V 0.5A TO-92

ADCMP600BRJZ-REEL7

ADCMP600BRJZ-REEL7

Analog Devices

IC COMP TTL/CMOS 1CHAN SOT23-5

MPQ7053

MPQ7053

Central Semiconductor Corp

TRANS 2NPN/2PNP 250V 0.5A

ISL9205IRZ-T

ISL9205IRZ-T

Renesas Electronics America Inc.

IC CHRGR LI-ION SGL 4.2V 16-QFN

74F00SC

74F00SC

ON Semiconductor

IC GATE NAND 4CH 2-INP 14SOIC