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XPC850SRVR66BU

XPC850SRVR66BU

For Reference Only

Part Number XPC850SRVR66BU
PNEDA Part # XPC850SRVR66BU
Description IC MPU MPC8XX 66MHZ 256BGA
Manufacturer NXP
Unit Price Request a Quote
In Stock 3,024
Warehouses Shipped from Hong Kong SAR
Estimated Delivery May 7 - May 12 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XPC850SRVR66BU Resources

Brand NXP
ECAD Module ECAD
Mfr. Part NumberXPC850SRVR66BU
CategorySemiconductorsEmbedded Processors & ControllersMicroprocessors
Datasheet
XPC850SRVR66BU, XPC850SRVR66BU Datasheet (Total Pages: 72, Size: 1,494.66 KB)
PDFKMPC850DSLVR50BU Datasheet Cover
KMPC850DSLVR50BU Datasheet Page 2 KMPC850DSLVR50BU Datasheet Page 3 KMPC850DSLVR50BU Datasheet Page 4 KMPC850DSLVR50BU Datasheet Page 5 KMPC850DSLVR50BU Datasheet Page 6 KMPC850DSLVR50BU Datasheet Page 7 KMPC850DSLVR50BU Datasheet Page 8 KMPC850DSLVR50BU Datasheet Page 9 KMPC850DSLVR50BU Datasheet Page 10 KMPC850DSLVR50BU Datasheet Page 11

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XPC850SRVR66BU Specifications

ManufacturerNXP USA Inc.
SeriesMPC8xx
Core ProcessorMPC8xx
Number of Cores/Bus Width1 Core, 32-Bit
Speed66MHz
Co-Processors/DSPCommunications; CPM
RAM ControllersDRAM
Graphics AccelerationNo
Display & Interface Controllers-
Ethernet10Mbps (1)
SATA-
USBUSB 1.x (1)
Voltage - I/O3.3V
Operating Temperature0°C ~ 95°C (TA)
Security Features-
Package / Case256-BBGA
Supplier Device Package256-PBGA (23x23)

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Number of Cores/Bus Width

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Speed

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Co-Processors/DSP

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RAM Controllers

DDR2, DDR3

Graphics Acceleration

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Display & Interface Controllers

LCD

Ethernet

10/100/1000Mbps (2)

SATA

SATA 3Gbps (2)

USB

USB 2.0 + PHY (2)

Voltage - I/O

-

Operating Temperature

0°C ~ 105°C (TA)

Security Features

Cryptography, Random Number Generator

Package / Case

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Supplier Device Package

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Manufacturer

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Series

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Core Processor

ARM® Cortex®-A9, ARM® Cortex®-M4

Number of Cores/Bus Width

2 Core, 32-Bit

Speed

200MHz, 800MHz

Co-Processors/DSP

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RAM Controllers

LPDDR2, LVDDR3, DDR3

Graphics Acceleration

Yes

Display & Interface Controllers

Keypad, LCD, LVDS

Ethernet

10/100/1000Mbps (2)

SATA

-

USB

USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)

Voltage - I/O

1.8V, 2.5V, 2.8V, 3.15V

Operating Temperature

-40°C ~ 125°C (TJ)

Security Features

A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE

Package / Case

529-LFBGA

Supplier Device Package

529-MAPBGA (19x19)

79RC32T355-133DHGI

IDT, Integrated Device Technology

Manufacturer

IDT, Integrated Device Technology Inc

Series

Interprise™

Core Processor

MIPS-II

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

133MHz

Co-Processors/DSP

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RAM Controllers

SDRAM

Graphics Acceleration

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Display & Interface Controllers

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Ethernet

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SATA

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USB

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Voltage - I/O

2.5V, 3.3V

Operating Temperature

-40°C ~ 85°C (TA)

Security Features

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Package / Case

208-BFQFP

Supplier Device Package

208-PQFP (28x28)

Manufacturer

NXP USA Inc.

Series

MPC8xx

Core Processor

MPC8xx

Number of Cores/Bus Width

1 Core, 32-Bit

Speed

80MHz

Co-Processors/DSP

Communications; CPM

RAM Controllers

DRAM

Graphics Acceleration

No

Display & Interface Controllers

-

Ethernet

10Mbps (1)

SATA

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USB

USB 1.x (1)

Voltage - I/O

3.3V

Operating Temperature

0°C ~ 95°C (TA)

Security Features

-

Package / Case

256-BBGA

Supplier Device Package

256-PBGA (23x23)

Manufacturer

NXP USA Inc.

Series

*

Core Processor

-

Number of Cores/Bus Width

-

Speed

-

Co-Processors/DSP

-

RAM Controllers

-

Graphics Acceleration

-

Display & Interface Controllers

-

Ethernet

-

SATA

-

USB

-

Voltage - I/O

-

Operating Temperature

-

Security Features

-

Package / Case

516-BBGA Exposed Pad

Supplier Device Package

516-TEPBGA (27x27)

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