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Infineon Technologies has introduced EasyPACK™ 4B in a new package

Apr 20 2023 2023-04 Semiconductors Infineon Technologies
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Infineon Technologies further expands its industry-leading Easy power module product line with the introduction of EasyPACK™ 4B in a new package. The first models in this package are targeted for applications such as string photovoltaic inverters with system output up to 352 kW.

     Infineon Technologies further expands its industry-leading Easy power module product line with the introduction of EasyPACK™ 4B in a new package. The first models in this package are targeted for applications such as string photovoltaic inverters with system output up to 352 kW. The EasyPACK™ 4B tandem inverter delivers about 40% more power than the 250 kW output of the previous generation inverter using EasyPACK 3B. Designed to achieve a simple but powerful inverter design with higher power density and lower system cost, the module is the ideal choice for 1500 VDC group string photovoltaic inverters.

     The introduction of the F3L600R10W4S7F_C22 starter model signals that the EasyPACK 4B with three DCBS is now the largest package of the Easy series. However, the module still features a baseless design, 12mm high package and PressFit pins with flexible lead-out positions. Like other Easy packages, EasyPACK 4B provides flexibility for platform-based solutions and reduces design effort by optimizing stray inductance. The package extends EasyPACK 3B's pressure mounting concept to ensure low thermal resistance (Rth) and improve robustness and product quality.

     The first model of F3L600R10W4S7F_C22 is an advanced mid-point clamp three-level (ANPC) topology. The structure uses the latest generation 1200V CoolSiC™ Schottky diode and the latest 950 V TRENCHSTOP™ IGBT7 chip technology for up to 600 A current. ANPC is a common topology structure of group series photovoltaic inverters, which is characterized by high operating efficiency and low power loss. The configuration of chip modules according to the topology can optimize the application of power semiconductor.

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