AFS090-1QNG108I Datasheet
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Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 37 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 108-WFQFN Supplier Device Package 108-QFN (8x8) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 37 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 108-WFQFN Supplier Device Package 108-QFN (8x8) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 37 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 108-WFQFN Supplier Device Package 108-QFN (8x8) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 37 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 108-WFQFN Supplier Device Package 108-QFN (8x8) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 37 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 108-WFQFN Supplier Device Package 108-QFN (8x8) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 37 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 108-WFQFN Supplier Device Package 108-QFN (8x8) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 60 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 36864 Number of I/O 65 Number of Gates 250000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 60 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 60 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 60 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 60 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
