AFS250-2QNG180I
For Reference Only
| Part Number | AFS250-2QNG180I |
| PNEDA Part # | AFS250-2QNG180I |
| Description | IC FPGA 65 I/O 180QFN |
| Manufacturer | Microsemi |
| Unit Price | Request a Quote |
| In Stock | 4,392 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Apr 22 - Apr 27 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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AFS250-2QNG180I Resources
| Brand | Microsemi |
| ECAD Module |
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| Mfr. Part Number | AFS250-2QNG180I |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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AFS250-2QNG180I Specifications
| Manufacturer | Microsemi Corporation |
| Series | Fusion® |
| Number of LABs/CLBs | - |
| Number of Logic Elements/Cells | - |
| Total RAM Bits | 36864 |
| Number of I/O | 65 |
| Number of Gates | 250000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 180-WFQFN Dual Rows, Exposed Pad |
| Supplier Device Package | 180-QFN (10x10) |
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Manufacturer Xilinx Inc. Series Virtex® Number of LABs/CLBs 1536 Number of Logic Elements/Cells 6912 Total RAM Bits 65536 Number of I/O 260 Number of Gates 322970 Voltage - Supply 2.375V ~ 2.625V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 352-LBGA Exposed Pad, Metal Supplier Device Package 352-MBGA (35x35) |
