EP2S15F672C3N
For Reference Only
| Part Number | EP2S15F672C3N |
| PNEDA Part # | EP2S15F672C3N |
| Description | IC FPGA 366 I/O 672FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 961 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 13 - Jun 18 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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EP2S15F672C3N Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP2S15F672C3N |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP2S15F672C3N Specifications
| Manufacturer | Intel |
| Series | Stratix® II |
| Number of LABs/CLBs | 780 |
| Number of Logic Elements/Cells | 15600 |
| Total RAM Bits | 419328 |
| Number of I/O | 366 |
| Number of Gates | - |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 672-BBGA, FCBGA |
| Supplier Device Package | 672-FBGA (27x27) |
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Manufacturer Intel Series Stratix® Number of LABs/CLBs 2566 Number of Logic Elements/Cells 25660 Total RAM Bits 1944576 Number of I/O 473 Number of Gates - Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 672-BBGA Supplier Device Package 672-BGA (35x35) |
Manufacturer Microsemi Corporation Series MX Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits - Number of I/O 150 Number of Gates 36000 Voltage - Supply 3V ~ 3.6V, 4.5V ~ 5.5V Mounting Type Surface Mount Operating Temperature -55°C ~ 125°C (TC) Package / Case 176-LQFP Supplier Device Package 176-TQFP (24x24) |
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Manufacturer Intel Series Cyclone® III Number of LABs/CLBs 1539 Number of Logic Elements/Cells 24624 Total RAM Bits 608256 Number of I/O 156 Number of Gates - Voltage - Supply 1.15V ~ 1.25V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FBGA (17x17) |
