EP3C16F256I7
For Reference Only
| Part Number | EP3C16F256I7 |
| PNEDA Part # | EP3C16F256I7 |
| Description | IC FPGA 168 I/O 256FBGA |
| Manufacturer | Intel |
| Unit Price | Request a Quote |
| In Stock | 5,022 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | May 2 - May 7 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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EP3C16F256I7 Resources
| Brand | Intel |
| ECAD Module |
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| Mfr. Part Number | EP3C16F256I7 |
| Category | Semiconductors › Embedded Processors & Controllers › FPGAs (Field Programmable Gate Array) |
| Datasheet |
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EP3C16F256I7 Specifications
| Manufacturer | Intel |
| Series | Cyclone® III |
| Number of LABs/CLBs | 963 |
| Number of Logic Elements/Cells | 15408 |
| Total RAM Bits | 516096 |
| Number of I/O | 168 |
| Number of Gates | - |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FBGA (17x17) |
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Manufacturer Intel Series Cyclone® IV E Number of LABs/CLBs 4713 Number of Logic Elements/Cells 75408 Total RAM Bits 2810880 Number of I/O 426 Number of Gates - Voltage - Supply 0.97V ~ 1.03V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 780-BGA Supplier Device Package 780-FBGA (29x29) |
Manufacturer Microsemi Corporation Series ProASIC3E Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 276480 Number of I/O 147 Number of Gates 1500000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 208-BFQFP Supplier Device Package 208-PQFP (28x28) |
Manufacturer Microsemi Corporation Series PolarFire™ Number of LABs/CLBs - Number of Logic Elements/Cells 192000 Total RAM Bits 13619200 Number of I/O 364 Number of Gates - Voltage - Supply 0.97V ~ 1.08V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 784-BBGA, FCBGA Supplier Device Package 784-FCBGA (29x29) |
