SLE66R35RMCC2XHSA1
For Reference Only
| Part Number | SLE66R35RMCC2XHSA1 |
| PNEDA Part # | SLE66R35RMCC2XHSA1 |
| Description | IC SECURITY CHIP CARD CTLR SMD |
| Manufacturer | Infineon Technologies |
| Unit Price | Request a Quote |
| In Stock | 6,192 |
| Warehouses | Shipped from Hong Kong SAR |
| Estimated Delivery | Jun 17 - Jun 22 (Choose Expedited Shipping) |
| Guarantee | Up to 1 year [PNEDA-Warranty]* |
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Free shipping on orders over $100. PNEDA is willing to provide you with better services.
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SLE66R35RMCC2XHSA1 Resources
| Brand | Infineon Technologies |
| ECAD Module |
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| Mfr. Part Number | SLE66R35RMCC2XHSA1 |
| Category | Semiconductors › Embedded Processors & Controllers › Microcontrollers - Application Specific |
Payment Method
- Penda is not limited to cash transfers. Checks and bill transfers are also accepted.
- If you need the detailed invoice or tax ID,please email us.
- Some orders may require a minimum amount of $100.00.
- Cheque or cash on delivery, processing may take an additional 3-5 days.
Logistics Mode
- Delivery time: At the same day (Order deadline is 2pm, HK Time).
- Delivery date: usually 2 to 7 working days.
- It is unable to appoint a date of delivery.
- Tracking number will be sent once your order has been shipped.
- It may take up to 24 hours before carriers display the info.
Notes
- Please confirm the specifications of the products when ordering.
- If you have special order instructions,please note it on the ordering pages.
- Registered users can log in to the account to view the order status.
- You can email us to change the order details before shipment.
- Orders cannot be canceled after shipping the packages.
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SLE66R35RMCC2XHSA1 Specifications
| Manufacturer | Infineon Technologies |
| Series | - |
| Applications | Security |
| Core Processor | - |
| Program Memory Type | - |
| Controller Series | - |
| RAM Size | - |
| Interface | ISO14443-3 Type A |
| Number of I/O | - |
| Voltage - Supply | - |
| Operating Temperature | -25°C ~ 70°C |
| Mounting Type | Surface Mount |
| Package / Case | Die |
| Supplier Device Package | Wafer |
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