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XC7Z045-2FFG676I

XC7Z045-2FFG676I XC7Z045-2FFG676I

For Reference Only

Part Number XC7Z045-2FFG676I
PNEDA Part # XC7Z045-2FFG676I
Description IC SOC CORTEX-A9 800MHZ 676FCBGA
Manufacturer Xilinx
Unit Price
1 ---------- $631.7046
50 ---------- $602.0934
100 ---------- $572.4823
200 ---------- $542.8711
400 ---------- $518.1952
500 ---------- $493.5192
In Stock 644
Warehouses Shipped from Hong Kong SAR
Estimated Delivery Jul 16 - Jul 21 (Choose Expedited Shipping)
Guarantee Up to 1 year [PNEDA-Warranty]*

XC7Z045-2FFG676I Resources

Brand Xilinx
ECAD Module ECAD
Mfr. Part NumberXC7Z045-2FFG676I
CategorySemiconductorsEmbedded Processors & ControllersSoC (System On Chip)
Datasheet
XC7Z045-2FFG676I, XC7Z045-2FFG676I Datasheet (Total Pages: 25, Size: 716.41 KB)
PDFXC7Z045-2FBG676CES Datasheet Cover
XC7Z045-2FBG676CES Datasheet Page 2 XC7Z045-2FBG676CES Datasheet Page 3 XC7Z045-2FBG676CES Datasheet Page 4 XC7Z045-2FBG676CES Datasheet Page 5 XC7Z045-2FBG676CES Datasheet Page 6 XC7Z045-2FBG676CES Datasheet Page 7 XC7Z045-2FBG676CES Datasheet Page 8 XC7Z045-2FBG676CES Datasheet Page 9 XC7Z045-2FBG676CES Datasheet Page 10 XC7Z045-2FBG676CES Datasheet Page 11

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XC7Z045-2FFG676I Specifications

ManufacturerXilinx Inc.
SeriesZynq®-7000
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDMA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed800MHz
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)

The Products You May Be Interested In

Manufacturer

Xilinx Inc.

Series

Zynq®-7000

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

667MHz

Primary Attributes

Kintex™-7 FPGA, 275K Logic Cells

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

900-BBGA, FCBGA

Supplier Device Package

900-FCBGA (31x31)

Manufacturer

Intel

Series

Arria 10 SX

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

1.5GHz

Primary Attributes

FPGA - 270K Logic Elements

Operating Temperature

-40°C ~ 100°C (TJ)

Package / Case

1152-BBGA, FCBGA

Supplier Device Package

1152-FBGA, FC (35x35)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC EG

Architecture

MCU, FPGA

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

533MHz, 600MHz, 1.3GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

1517-BBGA, FCBGA

Supplier Device Package

1517-FCBGA (40x40)

Manufacturer

Xilinx Inc.

Series

Zynq® UltraScale+™ MPSoC CG

Architecture

MCU, FPGA

Core Processor

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

Flash Size

-

RAM Size

256KB

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed

533MHz, 1.3GHz

Primary Attributes

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

Operating Temperature

0°C ~ 100°C (TJ)

Package / Case

625-BFBGA, FCBGA

Supplier Device Package

625-FCBGA (21x21)

M2S050-1VF400

Microsemi

Manufacturer

Microsemi Corporation

Series

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Architecture

MCU, FPGA

Core Processor

ARM® Cortex®-M3

Flash Size

256KB

RAM Size

64KB

Peripherals

DDR, PCIe, SERDES

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Speed

166MHz

Primary Attributes

FPGA - 50K Logic Modules

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

400-LFBGA

Supplier Device Package

400-VFBGA (17x17)

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