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Industry leading AC/DC converter IC from ROHM
2023-05
Semiconductors
Rohm Semiconductor
[May 17 2023] The BM2SC12xFP2-LBZ is an industry-leading AC/DC converter IC in an all-integrated package that has been built into a compact sticker package (TO263-7L) with a 1700V pressure-resistant SiC mosFETs and control circuits optimized for their drivers. It is mainly applicable to the auxiliary power supply of industrial equipment such as general inverter, AC servo, commercial air conditioner and street ...

NVIDIA Corporation launches dual Gpus for AI market
2023-05
Optoelectronics
GC Electronics
[May 17 2023] GPU producer Nvidia recently introduced its latest dual-GPU product, the H100NVL, specifically designed for the growing artificial intelligence (AI) market. The introduction of the H100NVL is expected to meet the high demand for data-intensive AI workloads, especially in data centers. Nvidia has been at the forefront of AI innovation for years, and its latest product further underscores the compa ...

Samsung Display announced that it will supply OLED panels to Ferrari to equip its cars with high-quality displays
2023-05
Semiconductors
Samsung
[May 17 2023] Samsung Display announced that it will supply OLED panels to Ferrari to equip its cars with high-quality displays. The news has attracted wide attention, making people full of expectations for the future development of the automobile industry. This article will introduce Samsung Display's supply of OLED panels to Ferrari, and discuss the future development of automotive display technology. First, ...

STMicroelectronics's first AI enhanced intelligent accelerometer
2023-05
Semiconductors
STMicroelectronics
[May 16 2023] STMicroelectronics has introduced three accelerometers with built-in advanced processing engines that improve the autonomous performance of the sensors, allowing the system to respond faster to external events while reducing power consumption.LIS2DUX12 and LIS2DUXS12 adopt the third-generation MEMS manufacturing process of Italian semiconductor, adding programmable features, including machine lea ...

Ai healthcare should be more than just robots and smart image management
2023-05
Sensors
Aries Electronics
[May 16 2023] Artificial intelligence medical treatment has long become a popular target for all parties. It is the strategy of the major companies to establish the lead with the technical advantages of the algorithm platform. The reason for targeting the medical field is to see the current situation of numerous hot spots and pain points in people's livelihood: the shortage of medical resources, the prominent ...

Verisilicon unveils super resolution technology for smart display devices
2023-05
Optoelectronics
Vector Electronics
[May 16 2023] Verisilicon has announced the launch of the Super resolution IP SR2000. The IP enables the low resolution video source to display at the terminal with high image quality and resolution, while reducing the network bandwidth occupied by image transmission. It can be widely used in many fields such as consumer electronics, data center, security monitoring and medical health. The SR2000 is designed t ...

IAR Embedded Secure IP ensures late product development security and upgrades embedded security solutions
2023-05
Optoelectronics
IPDiA
[May 16 2023] IAR, a global leader in Embedded development software and services, announced the launch of IAR Embedded Secure IP solution to help developers build embedded security solutions into their firmware applications, even late in the product project cycle. With IAR's new security solutions, embedded developers can easily build robust security into existing applications, even at a later stage in the sof ...

Infineon announced that its QDPAK and DDPAK Top Cooled (TSC) packages for high voltage MosFeTs have been successfully registered as JEDEC standard
2023-05
Semiconductors
Infineon Technologies
[May 16 2023] The pursuit of high efficiency and high power applications continue to develop towards higher power density and cost optimization, and also create sustainable value for electric vehicles and other industries. To address these challenges, Infineon Technologies announced that its QDPAK and DDPAK Top Cooling (TSC) packages for high voltage MosFeTs have been successfully registered as JEDEC standard. ...

Intel's contract manufacturing business and Arm announced a partnership to design multi-generation cutting-edge system chips
2023-05
Power
Intel
[May 16 2023] Intel Foundry Services (IFS) and Arm announced the signing of a multi-generation leading-edge system chip design. The agreement is designed to enable chip designers to leverage Intel 18A processes to develop low-power computing system-level chips (SoCs). The collaboration will initially focus on the design of mobile system-level chips and is expected to expand to automotive, Internet of Things, d ...

Infineon Technologies and Apex.AI have jointly developed a platform that will significantly speed up software development
2023-05
Semiconductors
Infineon Technologies
[May 16 2023] "The AURIX TC3x family of microcontrollers is already widely used in the automotive sector and is renowned in the industry for its reliability, scalable performance and broad customer base," said Thomas Schneid, Senior Director, Software, Partner & Ecosystem Management at Infineon Technologies. Our collaboration with Apex.AI will accelerate the software development and practical application of mi ...

Infineon develops supercomputers for highly automated, connected cars
2023-05
Semiconductors
Infineon Technologies
[May 16 2023] According to Infineon Technologies, high-performance computers built into the car that process all available data and information as quickly and reliably as possible so that the vehicle can be driven safely are key to an automated connected car. The Mannheim-Cecas research project aims to develop a corresponding supercomputing platform for vehicles. The project, which involves 30 research partner ...

Kioxia ships with West Number 218 story 3D NANDFlash
2023-05
Optoelectronics
Kionix Inc.
[May 15 2023] To demonstrate continued innovation in advanced flash memory technology, Kaixia Corporation and Western Digital Corporation released details of their latest 3D flash technology, which is currently in production. Using advanced miniaturization and wafer bonding technologies, the 3D flash is not only cost-attractive, but also offers superior capacity, performance and reliability, making it ideal to ...