Super heat dissipation capacity of gauge level meter attached power device package ACEPACK SMIT

     STMicroelectronics has introduced ACEPACK™ SMIT packaged power semiconductor devices in a variety of common bridge topologies. Stmicro's advanced ACEPACK™ SMIT package simplifies assembly and increases module power density compared TO traditional TO packages.engineers have five products to choose from: two STPOWER 650V MOSFET half-bridge modules, a 600V ultrafast diode rectifier module, a 1200V half-bridge full-wave rectifier module and a 1200V thyristor half-bridge rectifier module. All devices meet automotive industry requirements, suitable for electric vehicle on-board charger (OBC) and DC/DC converter, as well as industrial power conversion.

     STMicroelectronics ACEPACK SMIT mount package, top insulation heat dissipation, using direct bonded copper (DBC) patch technology for efficient top package cooling. A 4.6 cm2 bare metal surface on the top surface of the ACEPACK SMIT package allows for easy mounting of a flat radiator, thus saving space and achieving a flat design that maximizes heat dissipation efficiency and achieves greater reliability at high power levels. Modules and radiators can be installed using automated line equipment, which saves on manual production processes and increases productivity.

     STMicroelectronics ACEPACK SMIT mount package, top insulated heat dissipation, uses Direct bonded Copper (DBC) patch technology for efficient top package cooling. This package greatly improves the power density. The area of the top insulation and cooling surface is 32.7mm x 22.5mm, the creepage distance between pins is 6.6mm, the insulation voltage is 4500Vrms, and the parasitic inductance and capacitance of the package are also very low.

     A 4.6 cm2 bare metal surface on the top surface of the ACEPACK SMIT package allows for easy mounting of a flat radiator, thus saving space and achieving a flat design that maximizes heat dissipation efficiency and achieves greater reliability at high power levels. Modules and radiators can be installed using automated line equipment, which saves on manual production processes and increases productivity.