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The Molex Stac64 product range is certified to the most stringent automotive OEM standards

Feb 2 2012 2012-02 Power Molex
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Molex announced that its Stac64 Stackable Connection System has been successfully approved by major automotive original equipment manufacturers from Germany, France and Japan. OEM) the most stringent specification verification. In addition, a new patent has been issued for the Stac64 design.

     Molex announced that its Stac64 Stackable Connection System has been successfully approved by major automotive original equipment manufacturers from Germany, France and Japan. OEM) the most stringent specification verification. In addition, a new patent has been issued for the Stac64 design.

     Selvan Wilhelm, Global Product Manager at Molex, said: "Since the launch of the Stac64 product line two years ago, we have verified all major automotive OEM specifications for the Stac64 product line, exceeding the most stringent requirements. We are the only connector manufacturer in the world to be certified by a major automotive OEM, which is a strong testament to the extensive knowledge and experience Molex has gained by working closely with global automotive manufacturers."

     The Stac64 connection system was originally designed as a standard product system for non-hermetically sealed connector applications based on USCAR-2 Class II mechanical and electrical performance characteristics, and was later awarded a new patent related to stackable,connectors.Wilhelm added: "This Design evolution sets the Stac64 family apart from the standard products available on the market today and brings a new product specification to the Stac64 family and to the new Design Validation Plan Report (DVPR) worldwide."

     The Stac64 stackable connectivity system provides Oems with greater design flexibility, support for low level signal requirements, and power applications above 30.0A. It also enables manufacturers to use connector assemblies as individual components or combine multiple connectors to meet a wide variety of signal and power requirements for devices and modules.

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