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Ultrasonic lens cleaning chipsets can be realized for self cleaning cameras and sensors

Apr 19 2023 2023-04 Semiconductors Texas Instruments
Article Cover
Texas Instruments has introduced advanced specialized semiconductors using Ultrasonic Lens Cleaning (ULC) technology that enables camera systems to quickly detect and use tiny vibrations to remove dirt, ice and water

     Texas Instruments has introduced advanced specialized semiconductors using Ultrasonic Lens Cleaning (ULC) technology that enables camera systems to quickly detect and use tiny vibrations to remove dirt, ice and water. Historically, removing contaminants from camera lenses has required manual cleaning, which can cause system downtime or require the use of various mechanical components that can malfunction.

     TI's new ULC chipset, which includes the ULC1001 digital Signal processor (DSP) and the accompanying DRV2901 piezoelectric transducer driver, uses a proprietary technology that allows the camera to quickly self-remove contaminants using precisely controlled vibrations to quickly eliminate debris, This improves system accuracy and reduces maintenance requirements. The chipset provides designers with a compact and affordable way to use the ULC in a variety of applications and camera sizes.

     Avi Yashar, product Marketing Engineer at TI, said, "ULC can make widespread use of self-cleaning cameras and sensors a reality. Existing cleaning methods are costly and impractical, requiring complex machinery, expensive electronics and a lot of processing to detect contaminants and perform cleaning. With the proliferation of cameras in applications ranging from car and traffic cameras to smart cities and manufacturing, there is an urgent need for a simple and cost-effective way to implement self-cleaning cameras."

     The ULC1001 controller includes proprietary algorithms for automatic sensing, cleaning, temperature, and fault detection without any image processing, making ULC technology extremely adaptable for use in a variety of camera lens designs. The chipset's compact size makes it possible to improve machine vision and sensing in a variety of applications, anywhere a camera or sensor might get dirty.

     "As advanced driver assistance systems (ADAS) become more sophisticated and drivers increasingly rely on them, it's more important than ever to keep sensor suites up and running at all times," said Edward Sanchez, senior analyst for TechInsights' global automotive practice. Dirt or foreign objects on the camera lens are a nuisance for the rear-view camera, but a critical functional and safety issue for vehicles that rely on highly accurate imaging and sensor data. This will soon be a serious problem for ADAS and autonomous driving, and TI's ULC approach will solve it in a practical and affordable way."

     Using TI's ULC chipset eliminates the need for complex mechanical devices or human intervention in the lens cleaning system. Using a proprietary algorithm, the ULC1001 Ultrasonic cleaning DSP integrates a pulse width modulator, current and voltage detection amplifier, and an AD converter. TI's chipset, used in conjunction with the DRV2901 piezoelectric transducer driver as a companion amplifier, enables ULC in compact packages with PCB sizes smaller than 25mm x 15mm, reducing the material bill while providing more functionality than vertical implementations.

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