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Technology Articles

Records 3,183
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Dialog joins the power component market and GaN applications are expected to grow

2017-01 Semiconductors Dialog Semiconductor GmbH
[Jan 3 2017] Through TSMC's six-inch fab technology, Dialog launched the DA8801, Dialog's senior vice president of enterprise development and strategy Mark Tyndall said in an interview with CTIMES after the meeting that this component is currently the industry's first product to integrate logic components and GaN FETs into a single chip. TSMC's approach at the six-inch fab is to stack GaN layers on a silicon ...
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Cypress introduces new single-chip automotive MCU solutions for hybrid dashboards, head-up display systems and traditional instruments

2017-01 Semiconductors Cypress Semiconductor
[Jan 2 2017] Cypress Semiconductor announced the introduction of the new S6J32xE family of its Traveo automotive MCU(microcontroller) products, which provides greater storage for program code and graphical display Settings to support hybrid dashboard applications. The new highly integrated S6J32xE family of devices provides a single-chip solution to drive head-up display systems and traditional dashboard grap ...
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Vishay's new miniature infrared receiver offers improved light performance and RF noise suppression

2017-01 Connectors Vishay
[Jan 1 2017] Vishay Intertechnology has expanded its optoelectronics portfolio with the launch of two new families of micro infrared (IR) receiver modules -TSOP33xxx and TSOP53xxx - for mid-infrared remote control applications in consumer products. The Vishay Semiconductors TSOP33xxx and TSOP53xxx series devices are in the new Minimold package, with the same RF noise suppression as the Minicast receiver and s ...
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Microchip introduces the industry's first end-to-end security solution designed specifically for IoT devices connected to Amazon's AWS cloud platform

2016-12 Power Microchip Technology
[Dec 31 2016] Microchip Technology, the world's leading provider of integrated microcontroller, mixed-signal, emulator and flash memory patented solutions, announced the industry's first dedicated connection to Amazon Web Services IoT(AWS) An end-to-end security solution designed for Internet of Things (IoT) devices on the IoT cloud platform. Microchip and Amazon's AWS division worked together to develop this ...
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U-blox announces miniature GNSS receivers designed for asset tracking applications

2016-12 Connectors United Chemi-Con
[Dec 30 2016] U-blox, a global leader in wireless and positioning modules and chips, announced the introduction of the EVA-M8Q GNSS receiver, completing its portfolio of micro and low-cost EVA receivers in 7x7mm packages. Based on TCXO and optimized for optimal location capture and tracking sensitivity, the EVA-M8Q is ideal for covert tracking applications with small antennas, such as asset tracking, stolen ve ...
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STMicroelectronics' new ultra-thin low-voltage drop regulator in a breakthrough non-convex chip level package

2016-12 Connectors STMicroelectronics
[Dec 29 2016] STMicroelectronics introduces a very small LDBL20 200mA Low Voltage Drop (LDO) regulator. The new product is available in a 0.47mm x 0.47mm x 0.2mm chipscale package and is ideal for flexible product devices such as wearables, portable devices and multi-functional connected smart cards. The LDBL20's STSTAMP non-bump package breaks through the minimum I/O area and height limits of the traditional ...
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Littelfuse low capacitance transient suppression diode arrays are an affordable alternative to semiconductor-based common mode filters

2016-12 Passive Components Littelfuse
[Dec 28 2016] Littelfuse, Inc., a leading global provider of circuit protection solutions, announced the introduction of low-capacitance transient suppression diode arrays optimized for the protection of electronic devices that may experience damaging electrostatic discharge (ESD). The SP814x series Transient Suppression Diode Array (SPA diode) integrates four or six ultra-low capacitance rail-to-rail diode ch ...
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Micron Technology introduces mobile 3D NAND solutions for next-generation smartphones

2016-12 Power Micron Technology Inc.
[Dec 27 2016] Micron Technology, Inc. introduced the first 3D NAND storage technology for mobile devices and introduced the first products based on the Universal Flash Memory Storage (UFS) 2.1 standard. Micron's first mobile 3D NAND 32GB solution is targeted at the mid-to-high-end smartphone segment, which accounts for approximately 50% of the global smartphone market . As mobile devices replace PCS as consume ...
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Infineon's highly integrated Hall sensors significantly reduce system costs

2016-12 Sensors Infineon Technologies
[Dec 26 2016] The new generation of Hall sensors from Infineon Technologies AG ensures compliance with stringent environmental standards in automotive, industrial and consumer electronics applications. At the same time, they meet the requirements of cost-effective and compact design. The new generation of highly integrated TLx496x series Hall sensors features precise switching points, stable operating conditio ...
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Silicon Labs introduces the industry's first high-speed multi-channel PLC input isolator

2016-12 Connectors Silicon Labs
[Dec 25 2016] SiliconLabs introduces the industry's first high-speed, multi-channel digital isolator designed to meet the needs of programmable logic controller (PLC) applications. The new Si838x PLC isolator family offers an unmatched combination of features: high speed channels (up to 2Mbps), high channel integration (up to 8 channels per device), bipolar input flexibility, high anti-jamming and a 2.5kVRMS s ...
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Artesyn Embedded Technologies introduces a new family of 6W DC/DC power converters compliant with medical device safety regulations

2016-12 Power Artesyn Embedded Technologies
[Dec 24 2016] Artesyn Embedded Technologies announced the launch of the new ASA 6W-M series 6W DC/DC power converters. It is a cost-effective power system solution that enables Oems developing general industrial products or medical devices to develop industrial products or medical devices that meet stringent safety standards. The ASA6W-M series is equipped with a 4000V(AC) reinforced insulation resistance with ...
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Silicon Labs' new USBXpress controller simplifies USB connectivity for embedded designs

2016-12 Connectors Silicon Labs
[Dec 23 2016] Silicon Labs announced the launch of the CP2102N USB Bridge, the latest member of the USBXpress bridging device family, with a smaller size and lower power consumption that makes it easier and faster to add universal Serial bus (USB) connectivity to new or original embedded designs. Silicon Labs' new CP2102N USB controller eliminates complex, time-consuming firmware development and delivers more ...